摘要
针对复合材料层合结构与模具在固化工艺中的相互作用进行研究以提高制备精度。考虑摩擦力和粘结力在模具和制件接触界面间的共同作用,改进一种复合材料层合结构固化应变及应力情况的数值计算模型并与已有实验结果进行比较。引入弹簧单元建立固化工艺有限元模型,并对解析模型进行验证。最后通过解析模型对固化变形的影响因素进行探究。结果表明:所建立的解析预报模型具有较高的计算精度及一定的实用性;考虑模具作用的有限元模型可以更好地对层合板的变形趋势进行预报和分析。通过解析模型探究发现层合板长度、模具材料和表面情况均会对固化过程中的层间滑移产生影响,对工艺条件制定具有更好的指导意义。
The interaction between the composite laminate structure and the mold during the autoclave curing process was studied to improve the manufacturing accuracy. Considering the joint effect of frictional force and adhesive force at the contact interface between the mold and the component, a numerical calculation model for curing strain and stress of the composite laminate structure was improved and compared with the existing experimental results. The spring element was introduced to establish a finite element model of the curing process and used to verify the analytical model. Finally, the influencing factors of curing deformation were explored through the analytical model. The results show that the analytical forecast model established has high calculation accuracy and practicability. The finite element model considering the role of the mold can better predict the deformation trend of the laminate. Through analytical model exploration, it is found that the length of the laminate, the mold material and the surface condition will have an effect on the interlayer slip during the curing process, which has a better guiding significance for the formulation of process conditions.
作者
刘馨阳
赵海涛
袁明清
鞠雪梅
张博明
陈吉安
LIU Xinyang;ZHAO Haitao;YUAN Mingqing;JU Xuemei;ZHANG Boming;CHEN Ji’an(School of Aeronautics and Astronautics,Shanghai Jiao Tong University,Shanghai 200240,China;Aerospace System Engineering Institute of Shanghai,Shanghai 201108,China;School of Materials Science and Engineering,Beihang University,Beijing 100191,China)
出处
《复合材料学报》
EI
CAS
CSCD
北大核心
2021年第6期1974-1983,共10页
Acta Materiae Compositae Sinica
基金
上海航天科技创新基金(SAST2018-021)。
关键词
复合材料层合板
模具影响
滑动摩擦力
粘结力
固化模拟
composite laminate
mold influence
sliding friction condition
sticking force condition
curing simulation
