摘要
微系统技术在集成设计、特性评估方面存在诸多难题,以一款采用2.5D TSV、芯片堆叠技术的微系统陶瓷封装为研究对象,详细阐述了微系统封装方案设计、电学布局布线设计、热学设计以及电学、热学、力学仿真分析等内容,并介绍了如何针对仿真分析结果开展结构的优化设计,以获得更好的封装性能,对面向微系统集成的高可靠陶瓷封装设计与仿真具有指导性作用。
There are many difficulties in the integration design and characteristic evaluation of microsystem technology,a microsystem ceramic packaging with 2.5D TSV and chip stacking is taken as the research object,the design of microsystem packaging scheme,electrical layout and wiring design,thermal design as well as electrical,thermal,mechanical simulation analysis are described in detail.It also introduces how to optimize the structure according to the results of simulation analysis,so as to obtain better packaging performance,which can guide the design and simulation of high reliability ceramic packaging for microsystem integration.
出处
《信息技术与标准化》
2021年第7期11-15,20,共6页
Information Technology & Standardization
关键词
微系统技术
2.5D
TSV芯片堆叠
高可靠陶瓷封装
封装设计与仿真
microsystem technology
2.5D TSV chip stacking
high reliability ceramic packaging
packaging design and simulation
