摘要
系统级封装是将多个具有不同功能的有源电子元件与无源器件组装到一起,组成具有一定功能的封装体,从而形成一个系统或者子系统。在三维系统级封装技术中,基板堆叠是对芯片堆叠的有益补充。从基板堆叠的角度出发,分析了三维系统级封装所需HTCC一体化封装外壳形式以及各类三维系统级封装形式,提出系统级封装的发展趋势与面临的问题。
System-in-package was to assemble multiple active electronic components with different functions and passive components together to form a package with certain functions,so as to form a system or subsystem. In 3D system-in-package technology,substrate stacking was a beneficial supplement to chip stacking. From the perspective of substrate stacking,this paper analyzes the HTCC integrated package form and all kinds of 3D system-in-package forms,and puts forward the development trends and problems of system-in-package.
作者
庞学满
周骏
梁秋实
刘世超
PANG Xueman;ZHOU Jun;LIANG Qiushi;LIU Shichao(Nanjing Electronic Devices Institute,Nanjing,210016,CHN)
出处
《固体电子学研究与进展》
CAS
北大核心
2021年第3期161-165,共5页
Research & Progress of SSE
