摘要
近年来,微波组件向着高频段、小型化、高集成和低成本的方向发展,微波组件壳体材料也从传统的Kovar合金转变为更为轻质的铝合金等材料。由于轻质合金普遍熔点较低,较长时间高温加热容易使其软化,因此瞬时加热的感应钎焊技术在微波组件连接器的电子封装过程中具有显著优势。总结了微波组件连接器感应钎焊的技术特点,提出了一种辅助加热工装和利用预涂覆焊环进行连接器钎焊的创新工艺方法,针对性地进行了一系列轻质微波组件连接器的钎焊试验。试验结果表明,该创新工艺技术可有效提高钎透率和解决连接器漫锡的问题,从而实现轻质微波组件连接器的高质量钎焊。
In recent years,microwave modules have been developing towards high frequency,miniaturization,high integration and low cost.The shell material of multichip modules have also changed from traditional Kovar alloy to lightweight aluminum alloy.Due to the low melting point of lightweight alloy,it is easy to soften it after long time high temperature heating,the induction soldering technology with instantaneous heating has a signifi cant advantage in the electronic packaging process of microwave component connector.The technical characteristics of induction soldering for microwave connector are summarized.A new technique has been proposed,which contained an auxiliary heating fi xture and precoated solder ring.The related soldering test has been conducted,which proved that the overfl owing problem of multichip module connector can be solved and the new technology can effectively improve the penetration rate,subsequently leading to a way of high-effi ciency soldering work.
作者
汪锐
王禾
张丽
张鹏
汪秉庆
WANG Rui;WANG He;ZHANG Li;ZHANG Peng;WANG Bingqing(The 38th Research Institute of CETC,Hefei 230031,China)
出处
《电子工艺技术》
2021年第4期210-213,共4页
Electronics Process Technology
基金
装备预先研究项目(41423070103)。
关键词
微波组件
连接器
感应钎焊
轻质合金
microwave module
connector
induction soldering
lightweight alloy
