摘要
目的提升钽酸锂晶圆的加工效率和表面质量。方法采用8000#金刚石和树脂结合剂热压制成金刚石丸片,并拼接成固结磨盘,研磨钽酸锂。针对丸片配方的砂结比展开研究,设置3组砂结比变量11∶9、7∶3、17∶3,对应磨粒的质量分数分别为55%、70%、85%。通过单个磨粒晶胞模型计算磨粒裸露比,即单位面积内磨粒裸露数与总磨粒数的比值(Ng/N)。分析不同砂结比下磨粒与结合剂的分布状态变化,以及对加工钽酸锂晶圆表面粗糙度和材料去除率的影响规律。结果3组磨粒质量分数55%、70%、85%制作的金刚石丸片,其磨粒裸露比分别为1.79%、2.26%、2.47%,加工后对应的晶圆表面粗糙度分别为4.558、1.634、2.999 nm。磨粒质量分数为85%的丸片材料去除率最高,70%次之,55%最低。研究发现,磨具表面磨粒裸露比随磨粒质量比的增加而增加,当加工表面裸露颗粒越多时,其加工效率越高,材料去除速率越大。过低的磨粒质量比使得裸露磨粒少,晶圆表面材料去除不均匀,表面出现冗起,表面质量差;过高的磨粒质量比又使得树脂对磨粒的陷阱效应削弱,加工后晶圆表面易产生明显划痕。结论提高金刚石固结丸片砂结比,能有效地改善丸片表面的磨粒裸露比,实现钽酸锂高表面质量和高材料去除率的晶圆加工,但过高的砂结比极易导致表面划痕的产生。
In order to improve the machining efficiency and surface quality of lithium tantalite wafer,8000#diamond abrasive and resin bond were used to prepare diamond pellets and then assembled into a fixed-abrasive plate to lapping lithium tantalite.The sand to binder ratio of diamond pellet was analyzed in this experiment,and three kinds of sand to binder ratio of 11∶9,7∶3 and 17∶3,were set up,and the mass percentage of the corresponding abrasive particles were 55%,70%and 85%,respectively.A abrasive cell model was established to calculate the ratio between the number of bare abrasives and the total number of abrasives per unit area(Ng/N),the distribution of abrasive particles and binders at different sand to binder ratios and the effect on processing Lithium Tantalum wafers on surface roughness and material removal rate were also analyzed in the experiments.The percentages of abrasive mass of the diamond pellets were 55%,70%and 85%,and the corresponding bare ratios of abrasive grains were 1.79%,2.26%and 2.47%respectively.The surface roughness Ra of the wafer after lapping was 4.558 nm,1.634 nm and 2.999 nm.Compared with the former two,the pellet material removal rate with 85%abrasive mass fraction was the highest,followed by 70%,and 55%was the lowest.It was found that the bare ratio of abrasive particles on the abrasive tool surface increased with the increase of the mass ratio of abrasive particles,and had higher machining efficiency and material removal rate when more bare particles were present on the machined surface.Low abrasive mass ratio resulted in less bare abrasive particles,uneven removal of wafer surface materials,redundant surface,and the poor surface quality,weakensed the trapping effect of resin on abrasive particles by the high abrasive mass ratio,and obvious scratches were produced on the wafer surface after machining.Increasing the sand binder ratio of diamond pellets can effectively improve the bare ratio of abrasive grains on the surface of the pellets,so as to achieve high surface quality and high material removal rate for machining lithium tantalate wafer.However,too high sand binder ratio will lead to surface scratches.
作者
杭伟
凌洋
韦岚清
张翔
许良
陈泓谕
袁巨龙
HANG Wei;LING Yang;WEI Lan-qing;ZHANG Xiang;XU Liang;CHEN Hong-yu;YUAN Ju-long(Key Laboratory of Special Purpose Equipment and Advanced Processing Technology of the Ministry of Education,Zhejiang University of Technology,Hangzhou 310014,China)
出处
《表面技术》
EI
CAS
CSCD
北大核心
2021年第8期382-388,403,共8页
Surface Technology
基金
浙江省公益技术研究项目(LGG19E050021)
国家自然科学基金(51605440,51905485,U1604254)
中国博士后科学基金(2017M621966)。
关键词
固结磨盘
砂结比
钽酸锂
磨粒裸露比
表面粗糙度
材料去除率
fixed-abrasive plate
sand to binder ratio
lithium tantalate
bare abrasive ratio
surface roughness
material removal rate
