摘要
本文研究了化学镀前处理过程中铜离子对铝基表面化学镀镍磷(Ni-P)层的结构和质量的影响。采用扫描电子显微镜对浸锌过程中锌层以及化学镀Ni-P层的表面形貌进行了表征,并采用电化学阻抗谱与塔菲尔曲线对Ni-P层电化学抗腐蚀性能进行了分析。实验结果表明,Cu^(2+)处理提高了Ni-P层的表面平整性并改善了锌层中锌颗粒的大小以及分布的均匀性,表面平整和结构致密的化学镀层也使Ni-P层在3.5 wt.%NaCl溶液中的抗腐蚀性能得到极大提高。
The influence of Cu^(2+) pretreatment on the structure and properties of Ni-P films was studied.The surface morphology of zinc films and Ni-P films were characterized by the scanning electron mi‐croscopy(SEM)while the corrosion resistance of Ni-P films were analyzed by the electrochemical im‐pedance spectroscopy(EIS)and Tafel curves.The results show that the Cu^(2+) pretreatment can improve the uniformity of Ni-P films and modify the uniformity of the size and distribution of the zinc particles.The corrosion resistance of Ni-P film in 3.5 wt.%NaCl solution can be also enhanced after Cu^(2+) pretreat‐ment,which may be mainly due to the smooth surface and dense structure of Ni-P films.
作者
骆纬国
甘伟星
周天燊
李明
杭弢
LUO Weiguo;GAN Weixing;ZHOU Tianshen;LI Ming;HANG Tao(School of Material Science and Engineering,Shanghai Jiao Tong University,Shanghai 200240,China)
出处
《电镀与精饰》
CAS
北大核心
2021年第9期25-30,共6页
Plating & Finishing
