摘要
分析表明,闪存芯片测试的两个阶段晶圆测试和终端测试,都需要进行低温测试。低温制冷技术在两个测试阶段都得到了很大的应用。探讨在晶圆低温测试与终端低温测试过程中,两种不同制冷技术的应用。
The analysis shows that the two stages of flash chip testing,wafer testing and terminal testing,need low temperature testing.Low temperature refrigeration technology has been widely used in both test stages.The application of two different refrigeration technologies in wafer low temperature test and terminal low temperature test is discussed.
作者
张健健
ZHANG Jianjian(UNIMOS Microelectronics(Shanghai)Co.,Ltd.,Shanghai 201799,China)
出处
《集成电路应用》
2021年第8期23-25,共3页
Application of IC
基金
上海市科技企业技术创新课题项目。
关键词
集成电路测试
闪存芯片
晶圆测试
终端测试
制冷技术
integrated circuit testing
flash memory chip
wafer testing
terminal testing
refrigeration technology
