摘要
研究依托硅通孔实现信息处理微系统的技术。概述了传统信息处理系统小型化集成实现方式及新需求下所面临的发展瓶颈,依托“拓展摩尔定律”(More than Moore)战略成为信息处理系统具备高密度、多功能、多工作模式能力的重要实现方式,硅通孔TSV(Through Silicon Vias)为上述需求提供了重要的支撑手段;着重阐述了信息处理类微系统的优势和设计、实现、测试等方面的关键技术,并展示了已实现的多种信息处理微系统产品组成形态,最后对信息处理微系统产品的应用前景进行了展望,阐述了关键技术对信息处理微系统实现支撑的优越性。
This paper focuses on the information processing microsystem technologies based on Through Silicon Vias.Firstly,traditional information processing microsystem integrated implementation and development bottleneck under new demand are introduced,and relying on More than Moore strategy has become an important way to implement information processing microsystem with high density,multi function and more work pattern ability.All above requirements can be supported by TSV.The advantages of information processing microsystem and key technologies in design,realization and test are presented,and composition of various microsystem product have been showed at the same time.Finally,the application prospect of information processing microsystem products has been prospected with the advantages of key technologies to support the information processing microsystem.
作者
唐磊
郭雁蓉
赵超
匡乃亮
吴道伟
TANG Lei;GUO Yanrong;ZHAO Chao;KUANG Nailiang;WU Daowei(Xi'an Institute of Microelectronics Technology,Xi’an 710065,China)
出处
《遥测遥控》
2021年第5期55-62,共8页
Journal of Telemetry,Tracking and Command
关键词
信息处理
微系统
硅通孔
微凸点
Information processing
Microsystem
TSV
Ubump
Micro bumping
