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高级驾驶辅助系统热仿真

Thermal Simulation of Advanced Driving Assistance System
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摘要 文中对某高级驾驶辅助系统(Advanced Driving Assistance System, ADAS)硬件做了详细的热仿真。首先对前视摄像头、美化罩及乘员舱做了大空间自然对流简化,同时根据流动轨迹确定了美化罩最优的进风孔和出风孔开孔方式,然后根据主动安全域控制器的仿真结果得到了域控制器最优的安装位置和安装空间。介绍了芯片结温的计算方法,根据结温判断芯片是否满足散热设计要求。最后对热仿真和热测试得到的关键器件壳温做了对比,结果表明热仿真的相对误差小于3%。文中的仿真方法和结果可为ADAS硬件的散热设计和可靠性评估提供参考。 A detailed thermal simulation of advanced driving assistance system(ADAS)hardware is carried out in this paper.Firstly,the forward looking camera,the embellishment cover and the passenger compartment are simplified as natural convection in a large space.At the same time,the optimal opening pattern of air inlet and outlet of the cover are determined according to the flow trajectory.Then according to the simulation results of active safety domain master,the optimal installation location and space of the domain master are obtained.The calculation method of chip junction temperature is introduced,and the satisfaction of the heat dissipation design requirements is judged according to the junction temperature.Finally,the case temperatures of key components obtained by thermal simulation and thermal test are compared.The results show that the relative error of thermal simulation is less than 3%.The simulation methods and results in this paper can provide reference for the thermal design and reliability evaluation of ADAS hardware.
作者 王飞 张科 全坤 WANG Fei;ZHANG Ke;QUAN Kun(Veoneer China Co.,Ltd.,Shanghai 201103,China)
出处 《电子机械工程》 2021年第5期44-47,共4页 Electro-Mechanical Engineering
关键词 高级驾驶辅助系统 热仿真 热测试 结温 ADAS thermal simulation thermal test junction temperature
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