摘要
受中美国际关系的影响,一段时间内,集成电路工艺制程可能难以突破;同时,先进半导体工艺将带来高昂的集成电路开发成本,已经不适应于军用信息处理领域的发展需求.信息处理微系统可在微纳尺度集成各种成熟技术,通过系统优化设计,一定程度摆脱半导体工艺及器件代差的制约与跟仿,提高质量水平的前提下大幅缩短研制周期,解决装备的自主可控和研制效率问题.本文调研了信息处理微系统技术的国内外研究现状,提炼并总结了该技术的特点,从互连接口与协议、封装技术以及质量控制等方面分析了面临的挑战;从设计、工艺、测试和可靠性四个方面对信息处理微系统的研究趋势进行了展望,并提出了发展建议.
Affected by Sino-US international relations,it may be difficult to make breakthroughs in integrated circuit manufacturing processes for a period of time.At the same time,Advanced semiconductor technology will bring high integrated circuit development costs,which is no longer suitable for the development needs of military information processing.Information processing micro-systems can integrate various mature technologies at the micro-nano scale.Through system optimization design,the information processing micro-systems can get rid of the restriction of the generation difference of semiconductor technology and device to a certain extent.Therefore,on the premise of improving the quality level,the development cycle is greatly shortened,and the problems of independent controllability and development efficiency of equipment are solved.In this paper,the current research status of information processing micro-system technology at home and abroad is investigated.The characteristics of the technology are summarized.The challenges faced by information processing micro-systems are analyzed from the aspects of interconnection interface and protocol,packaging technology,quality control,etc.The research trend of information processing micro-systems is prospected from the four aspects of design,process,test and reliability.Finally,development suggestions are put forward.
作者
唐磊
匡乃亮
郭雁蓉
刘莹玉
TANG Lei;KUANG Nailiang;GUO Yanrong;LIU Yingyu(Xi′an Microelectronics Technology Institute,Xi′an 710054,Shaanxi,China)
出处
《微电子学与计算机》
2021年第10期1-8,共8页
Microelectronics & Computer
关键词
信息处理
微系统
硅通孔
先进封装
异构集成
information processing
micro-system
through silicon via
advanced packaging
heterogeneous integration
