摘要
随着集成电路制造技术的发展,人们对电子器件柔性化、制备效率及环境友好的要求越来越高。印制电路板作为器件的载体,目前仍使用模板印刷后刻蚀等方法制备,在小批量制备时效率低下,且其基板多为刚性环氧树脂,难以满足曲面及柔性电路的要求。喷墨打印作为增材制造技术中的一种,可迅速在平整或弯曲表面沉积特定材料,从而实现图案化,有着高效、非接触、无污染等特点,在电子制造领域显现出了巨大优势。本文以喷墨打印电路板为例,对其中涉及的打印材料、提高图案精度的方法、烧结技术及打印缺陷四方面对喷墨打印制备电路板的研究进展进行介绍,并对喷墨技术在该领域的发展做出了展望。
With the development of the integrated circuit manufacturing technology,the requirements of electronic device,such as flexibility,manufacturing efficiency and environmental friendliness,are getting higher.As the carrier of the device,the printed circuit board is still prepared by methods such as etching,which is inefficient for small batch preparation.And the substrate is mostly rigid epoxy resin,which is difficult to meet the requirements of curved and flexible circuits.As one kind of additive manufacturing technology,inkjet printing can quickly deposit specific materials on the flat or curved surfaces for patterning,which has the characteristics of high efficiency,non-contact,and pollution-free.So it has shown huge advantage in the field of electronics manufacturing.In this article,the inkjet printed circuit boards is taken as an example,the research progress of inkjet printing to prepare circuit board is introduced,including printing materials,methods for improving pattern accuracy,sintering technology and printing defects.Finally,the prospect of the inkjet technology is proposed.
作者
杨登科
傅莉
李超
尹恩怀
袁学礼
YANG Dengke;FU Li;LI Chao;YIN Enhuai;YUAN Xueli(Northwestern Polytechnical University,Xi'an 710000,China;Xi'an Ruite 3D Technology Co.,Ltd.,Xi'an 710000,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2021年第10期962-974,共13页
Electronic Components And Materials
基金
装备预研中国电科联合基金(6141B08120301)。
关键词
印制电路板
喷墨打印
综述
增材制造
墨水
低温烧结
printed circuit boards
inkjet printing
review
additive manufacturing
ink
low temperature sintering
