摘要
针对IGBT芯片结温难以直接测量的问题,提出了一种基于热传导模型的IGBT结温计算方法。基于经典的Cauer型RC网络结构,建立了变流器热传导模型;结合传递函数概念和热传导模型结构,完成了变流器热传导模型的参数识别;通过查阅IGBT产品手册以及实际工作工况,计算得到IGBT实时功率损耗;最终通过MATLAB/Simulink进行仿真计算,得到变流器IGBT芯片的实时结温。此方法实现了IGBT芯片结温的快速计算,为IGBT可靠性和寿命评估提供了数据支撑,同时也为功率模块及变流器的设计研发提供了新的科学依据。
Aiming at the problem that the junction temperature of IGBT chip is difficult to measure directly, a calculation method of IGBT junction temperature based on heat conduction model was proposed. The heat conduction model of the converter was established based on the classic Cauer RC network structure;the parameter identification of the heat conduction model of the converter was completed by combining the concept of transfer function and the structure of heat conduction model;the real-time power loss of the IGBT was calculated by consulting the IGBT product manual and the actual working conditions;finally, the simulation calculation was carried out by MATLAB/Simulink, and the real-time junction temperature of IGBT chip on the converter was obtained. This method realizes the fast calculation of IGBT chip junction temperature, provides important data support for IGBT reliability and life evaluation, and provides a new scientific basis for the design and development of power modules and converters.
作者
陈新
王益民
王鹏
CHEN Xin;WANG Yiming;WANG Peng(Inspection and Test Center,Zhuzhou CRRC Times Electric Co.,Ltd.,Zhuzhou,Hunan 412001,China)
出处
《机车电传动》
北大核心
2021年第5期111-114,共4页
Electric Drive for Locomotives
关键词
IGBT芯片
热传导模型
功率损耗
结温计算
仿真
IGBT chip
heat conduction model
power loss
junction temperature calculation
simulation
