摘要
为了提高化学气相沉积(Chemical Vapor Deposition,CVD)金刚石的切深,采用新型的声光调制高重复频率激光器,研究了激光功率、焦点位置、激光重复频率、切割线速度以及激光横膜模式对CVD金刚石切缝宽度、切深以及表面粗糙度的影响。研究结果表明:切深和切缝上表面宽随着激光功率的增大而增大;焦点位置随切深的变化下移,可获得最大切深;重复频率的增大伴随着切深的减小和切缝上表面宽的增大;表面粗糙度随着切割线速度的增大先缓慢减小后显著增大;切缝上表面宽随着模式数的增多而增大。综合切深、缝宽和效率,最后在输出基横模下激光功率为12 W,重复频率为6 kHz,切割线速度为1500 mm/min,焦点位置始终位于切割凹面,获得了效率最快、质量最好的结果,即单向切深最大可达7.2 mm,切面表面的粗糙度为0.804μm,切缝上表面宽度为350μm,满足在低切面表面粗糙度下获得CVD金刚石大切深的要求。
To improve the cutting depth of chemical vapor deposition(CVD)diamond,the effects of laser power,focus position,repetitive frequency,scanning speed,and transverse mode on the width of cutting seam,cutting depth,and roughness of CVD diamond was used to achieve a novel high repetition rate laser with acousto-optic modulation.The results show that the cutting depth and width of upper kerf increased with the increase in laser power;the maximum cutting depth was obtained when the focus was moved down along with cutting depth;the cutting depth decreased and the width of upper kerf increased with an increase in repetition frequency;with the increase in cutting speed,the surface roughness decreased slowly and increased significantly subsequently;the width of upper kerf increased with the increase in the number of laser modes.The best result is obtained with a unidirectional cutting depth of 7.2 mm,surface roughness of 0.804μm,and kerf’s width of 350μm,while the laser power is 12 W,repetition frequency is 6 kHz,cutting speed is 1500 mm/min,and the focus position is located on the concave surface.Hence,a large cutting depth of CVD diamond with low surface roughness is achieved.
作者
王吉
章鹏
张天润
曹小文
张文武
WANG Ji;ZHANG Peng;ZHANG Tianrun;CAO Xiaowen;ZHANG Wenwu(Ningbo Insitute of Materials Technology and Engineering,Chinese Academy of Sciences,Ningbo 315201,China;Ningbo Da'ai Laser Technology Co.,Ltd,Ningbo 315201,China)
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2022年第1期89-95,共7页
Optics and Precision Engineering
基金
国家自然科学基金青年基金资助项目(No.51805525)
浙江省重点研发项目(No.2020C01036)
宁波市2025科技重大专项(No.2019B10074)
宁波市自然科学基金资助项目(No.2021J215)。
关键词
激光切割
化学气相沉积金刚石
高频激光
缝宽
切深
表面粗糙度
laser cutting
chemical vapor deposition diamond
high repetition rate laser
width of cutting seam
cutting depth
surface roughness
