摘要
本文描述了超声显微成像技术的发展历史,检测系统的构成及检测原理,介绍了超声显微成像技术的特点和局限性,根据其特点分析了适用于超声显微成像技术的工业产品及材料。对超声显微成像技术在国内工业产品及材料的应用情况进行了简要介绍,包括半导体电子元件检测、薄型工件检测、多层复合材料检测、涂层检测等。超声显微成像技术适用于厚度较小,需要较高检测灵敏度的工业产品、薄型工件及复合材料检测。由于采用较高的检测频率,能够发现材料表面或内部存在的微小缺陷,检测灵敏度达到微米级,对于面积型缺陷如结合不良、微小裂纹等特别敏感。
This paper describes the development history of Ultrasonic Micro Imaging technology,the composition of detection system and detection principle.It introduces the characteristics and limitations of Ultrasonic Micro Imaging technology,and analyzes the industrial products and materials suitable for Ultrasonic Micro Imaging technology.According to its characteristics,the industrial products,and materials suitable for Ultrasonic Micro Imaging technology are analyzed.The application of ultrasonic microscopy in domestic industrial products and materials is briefly introduced,including semiconductor electronic component detection,thin workpiece detection,multilayer composite material detection,coating detection and so on.Ultrasonic Micro Imaging technology is suitable for the detection of industrial products,thin workpieces and composites with small thickness and high detection sensitivity.Due to the high detection frequency,micro defects on the surface or inside of the material can be found,and the detection sensitivity reaches the micron level.It is particularly sensitive to area defects such as poor bonding and micro cracks.
作者
任俊波
王学权
罗建东
李骥
童靖垒
REN Junbo;WANG Xuequan;LUO Jiandong;LI Ji;TONG Jinglei(Nuclear Power Institute of China,Chengdu,Sichuan Province,610213 China)
出处
《科技创新导报》
2021年第24期51-53,共3页
Science and Technology Innovation Herald
关键词
超声显微成像技术
半导体检测
薄型工件检测
多层复合材料检测
Ultrasonic Micro Imaging technology
Semiconductor detection
Thin workpiece inspection
Inspection of multilayer composites
