摘要
本文利用TRIZ创新方法提高BGA芯片贴装精度。运用TRIZ工具产生9个概念方案,针对解决方案进行分析、评估,最终确定了一种组合解,提高了BGA芯片贴装精度。
In this paper,the TRIZ innovative method is used to solve the BGA chip mount precision problem.Nine scenarios are produced by using TRIZTOOL.According to the analyses and evaluations of the solutions,a combination solution is finally determined,which can improves the BGA chip mounting precision.
作者
程虎
Cheng Hu(WuHan Digital Engineering Institute,Wuhan430205,China)
出处
《船电技术》
2022年第2期55-60,共6页
Marine Electric & Electronic Engineering
