摘要
Despite being strong with many outstanding physical properties,tungsten is inherently brittle at room temperature,restricting its structural and functional applications at small scales.Here,a facile strategy has been adopted,to introduce high-density dislocations while reducing grain boundaries,through electron backscatter diffraction(EBSD)-guided microfabrication of cold-drawn bulk tungsten wires.The designed tungsten microwire attains an ultralarge uniform tensile elongation of~10.6%,while retains a high yield strength of~2.4 GPa.in situ TEM tensile testing reveals that the large uniform elongation of tungsten microwires originates from the motion of pre-existing high-density dislocations,while the subsequent ductile fracture is attributed to crack-tip plasticity and the inhibition of grain boundary cracking.This work demonstrates the application potential of tungsten microcomponents with superior ductility and workability for micro/nanoscale mechanical,electronic,and energy systems.
基金
supported by the Hong Kong Research Grant Council(RGC)under projects City U11207416
National Natural Science Foundation of China(NSFC)under grant 11922215
City University of Hong Kong under grant 7005234 and 9667194。
