摘要
为了有效提高微通道散热器的散热性能,设计了一种含有类水滴状微结构的微通道散热器,并采用仿真模拟方法研究了微通道内类水滴状微结构的数量和高度变化对微通道的压力损失和散热性能的影响。在热流密度为100 W/cm^(2),入口端流体速度为1 m/s的条件下,设计了9组不同的含类水滴状微结构微通道。其中的5组通过改变单条微通道内类水滴状微结构的数量进行研究,得出当微结构数量为7时微通道的综合散热性能最优,其微通道底面平均温度下降了18.42 K,散热系数提高了37.63%。同时在微结构数量为7的基础上再次设计4组微通道,研究了微结构的高度对微通道散热性能的影响,得出当各微结构的高度沿流体流动方向逐次增高时,散热系数几乎不变,压力损失降低了11.93%。
In order to effectively improve the heat dissipation performance of the micro-channel radiator, a microchannel radiator with droplet-like microstructure was designed, and the influence of the number and height of the droplet-like microstructure on the pressure loss and heat dissipation performance of the microchannel was studied by simulation method. In this paper, under the conditions as the heat flux of 100 W/cm^(2) and the fluid velocity of 1 m/s at the inlet, 9 groups of different micro-channels with droplet-like microstructure were designed. Five groups were studied by changing the number of droplet-like microstructures in a single microchannel. It was found that when the number of microstructures was 7, the comprehensive heat dissipation performance of the microchannel was the best, and the average temperature of the bottom of the microchannel decreased by 18.42 K, the heat dissipation coefficient increased by 37.63%. At the same time, four groups of micro-channels were designed based on the number of 7 microstructures to study the influence of the height of the microstructures on the heat dissipation performance of the micro-channels. When the height of each microstructure in the micro-channels increased along the flow direction, the heat dissipation coefficient of the micro-channels basically unchanged, while the pressure loss was reduced by 11.93%.
作者
曹卫华
商维佳
朱继元
CAO Weihua;SHANG Weijia;ZHU Jiyuan(College of Mechanical and Control Engin.,Guilin University of Technology,Guilin 541004,CHN)
出处
《半导体光电》
CAS
北大核心
2021年第6期868-874,共7页
Semiconductor Optoelectronics
基金
广西自然科学基金项目(2018GXNSFAA050006)。
关键词
微通道
类水滴状
散热性能
流动性能
热设计
microchannel
droplet like
heat transfer performance
flowing property
thermal design