摘要
随着电子器件芯片功率的不断提高,对散热材料的热物理性能提出了更高的要求。将高导热、低膨胀的增强相和高导热的金属进行复合得到的金属基复合材料,能够兼顾高的热导率和可调控的热膨胀系数,是理想的散热材料。本文对以Si、SiC_(p)、金刚石、鳞片石墨为增强相的铜基及铝基复合材料的研究进展进行了总结,并就金属基复合材料目前存在的问题及未来的研究方向进行了展望。
With the increasing power of the electronic device chip,the higher requirements are put forward for the thermophysical properties of the heat dissipation materials.The metal matrix composites as the ideal heat dissipation material,which are composed of the high thermal conductivity and low thermal expansion reinforcement phase and the high thermal conductivity metal,show the high thermal conductivity and the adjustable coefficient of thermal expansion.The research progress of the copper matrix and aluminum matrix composites reinforced by Si,SiC_(p),diamond,and flake graphite in recent years was summarized in this paper,and the existing problems and future research direction of the metal matrix composites were prospected.
作者
陈贞睿
刘超
谢炎崇
潘志忠
任淑彬
曲选辉
CHEN Zhen-rui;LIU Chao;XIE Yan-chong;PAN Zhi-zhong;REN Shu-bin;QU Xuan-hui(Institute for Advances Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China;Xiamen Tungsten Co.,Ltd.,Xiamen 361000,China;Luoyang Golden Egret Geotools Co.,Ltd.,Luoyang 471000,China)
出处
《粉末冶金技术》
CAS
CSCD
北大核心
2022年第1期40-52,共13页
Powder Metallurgy Technology
基金
国家自然科学基金资助项目(51874038)
广东省重点研发计划资助项目(2019B010942001)
中央高校基本科研基金资助项目(FRF-NP-20-08)。
关键词
金属基复合材料
热导率
物理性能
研究进展
metal matrix composites
thermal conductivity
physical properties
research progress
