摘要
对一种典型2.5D封装结构在回流焊工艺过程的热应力进行仿真。通过对比分析传统热力学仿真方法与基于生死单元技术的热力学仿真方法,研究了计算方法对热应力计算结果的影响。在相同参考温度下,由不同计算方法得到的硅通孔(TSV)转接板应力结果相差不大,从焊球应力结果可推测出,基于生死单元技术的热力学仿真方法考虑了残余应力的累积模拟更适合于回流焊过程的热应力仿真。研究了2.5D封装回流焊过程中参考温度的选择对计算结果的影响,选用最高参考温度作为各个组件的参考温度,通常得到TSV转接板的应力值偏大,模拟的结果会更加偏于激进。通过对2.5D封装结构回流焊过程进行热应力分析,对比分析了计算模拟方法和参考温度的选择对最终计算结果的影响。该方法同样可用于指导其他同类2.5D封装结构应力的计算和分析。
The thermal stress of a typical 2.5 D package structure during the reflow soldering process was simulated.By analyzing and comparing the traditional thermodynamic simulation method with the thermodynamic simulation method based on the birth and death element technology,the influence of the calculation method on the calculation results of the thermal stress was studied.At the same reference temperature,the results of the through silicon via(TSV)interposer obtained by different calculation methods are almost the same.From the results of the solder ball stress,it can be inferred that considering the accumulation simulation of residual stress,the thermodynamic simulation method based on the birth and death element technology is more suitable for the thermal stress simulation during the reflow soldering process.The influence of the selection of the reference temperature during the reflow soldering process of the 2.5 D package on the calculation results was studied.When the maximum reference temperature was selected as the reference temperature of each component,the stress value of the TSV interposer was usually larger,and the simulation results were more radical.Through the thermal stress analysis of the reflow soldering process of the 2.5 D package structure,the influences of the selections of the calculation simulation method and the reference temperature on the final calculation results were analyzed.This method can also be used to guide the stress calculation and analysis of other similar 2.5 D package structures.
作者
李逵
吴婷
赵帅
郭雁蓉
杨宇军
代岩伟
秦飞
Li Kui;Wu Ting;Zhao Shuai;Guo Yanrong;Yang Yujun;Dai Yanwei;Qin Fei(Xi'an Institute of Microelectronic Technology,Xi'an 710000,China;Institute of Electronics Packaging Technology and Reliability,Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China;Beijing Key Laboratory of Advanced Manufacturing Technology,Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China)
出处
《半导体技术》
CAS
北大核心
2022年第2期152-158,共7页
Semiconductor Technology
关键词
2.5D封装结构
回流焊
热应力分析
参考温度
生死单元
2.5D package structure
reflow soldering
thermal stress analysis
reference temperature
birth and death element
