摘要
采用纳秒脉冲式紫外激光清洁微波印制板引线键合焊盘,阐述了激光清洁焊盘的基本原理,对比了清洁前后的形貌,开展了焊盘上金钉头凸点抗剪切强度和楔焊金丝破坏性拉力进行测试。研究结果表明:激光清洁在不损伤焊盘基体的情况下,去除焊盘表面多余物,修饰表面形貌,金钉头凸点剪切强度和自动楔焊金丝拉力均得到提高。
A nanosecond pulsed UV laser is used to clean the wire bonding pad of microwave printed board.The basic principle of laser cleaning is described,and the morphology of the pad before and after cleaning is compared.The shear strength of the gold stud bump on the pad and the destructive tensile force of the gold wire wedge bonding are tested.The results show that laser cleaning can remove excess residue and modify the surface morphology without damaging the substrate of the pad.The shear strength of gold stud bump and destructive tension of gold wire wedge bonding are improved.
作者
王运龙
王道畅
张加波
刘建军
WANG Yunlong;WANG Daochang;ZHANG Jiabo;LIU Jianjun(The 38th Research Institute of CETC,Hefei 230088,China)
出处
《电子工艺技术》
2022年第2期81-84,共4页
Electronics Process Technology
基金
装备预先研究(共用技术)项目。
关键词
激光清洁
微波印制板
引线键合
laser cleaning
microwave printed boards
wire bonding
