摘要
近年来,全球半导体封装测试市场规模增长明显,在摩尔定律不断逼近物理极限大背景下,半导体前道和后道工序加速融合,先进封装成为行业关注焦点,并将重塑半导体行业竞争格局。晶圆代工厂、IDM(集成器件制造商)涉足先进封装业务,Chiplet(芯粒)技术引领先进封装发展,多片异构成未来主流;先进封装带动异质器件集成新发展,集成电路加乘人工智能与异质整合成为产业新趋势。同时先进封装也为半导体产业迎来新的机遇与挑战,质量标准体系建设更加迫切,伴随着Chiplet和异质整合的发展趋势,商业模式将迎来新变革,对半导体行业影响深远。
In recent years,the market of the global semiconductor packaging grows significantly.In the context of Moore's law approaching the physical limit,the integration of the former and the latter processes of semiconductor has accelerated.The field of advanced packaging has become the focus,which will reshape the competitive pattern of the semiconductor industry.Moreover,foundry Fabs and IDM firms have been engaged in advanced packaging business.Chiplet technology leads the development of advanced packaging,as a major future with multiple chip heterogeneous;Advanced packaging promoting new developments for the IC Industry of heterogeneous integration,and the integration of IC plus artificial intelligence and heterogeneous integration becomes a new trend in the semiconductor industry.At the same time,advanced packaging industry also brings new opportunities and challenges.It is more important for quality standard system construction.With the development trend of Chiplet and heterogeneous integration,new changes will influence the business model,and bring out a profound impact on the IC industry.
作者
王若达
WANG Ruo-da(China Center for Information Industry Development)
出处
《中国集成电路》
2022年第4期26-29,42,共5页
China lntegrated Circuit
关键词
先进封装
Chiplet
异质整合
竞争格局
Advanced packaging
Chiplet
Heterogeneous integration
Competition pattern
