摘要
主要对三种高速多层PCB材料进行高湿环境下工作十年以上的老化模拟,采用恒温恒湿箱对其进行温度为98℃、湿度为85%RH的条件下的老化。借助3D景深显微镜和矢量网络分析仪分别对PCB基板的耐热可靠性和表面差分线上的高速信号的插入损耗进行了测试与研究。结果表明,经过老化处理771 h后,PCB基板未出现可靠性问题,且插损劣化程度小于20%,保证了其在温度25℃及湿度80%RH的条件下能够维持10 a的工作寿命。同时,在一定的湿度条件下随着时间的增加,其插损值先增大,而后保持稳定。
The aging simulation of three types of high-speed multi-layer PCB materials in a high-humidity environment for ten years or longer is mainly carried out,and the PCB materials are aged under the condition of 98℃and 85%RH in constant temperature and humidity box.The heat-resistant reliability of the PCB and the insertion loss of high-speed signals on the differential lines of surface are tested and studied respectively with the help of the 3D microscope and vector network analyzer.The results show that after aging treatment for 771 h,no reliability problem occurs on the PCB,and the insertion loss deterioration degree is less than 20%,which ensures that it can maintain a working life of 10 years under the condition of temperature 25℃and humidity 80%RH.At the same time,under certain humidity conditions,with the increase of time,the insertion loss increases first and then remains stable.
作者
曾福林
安维
李冀星
陈佳
任英杰
韩梦娜
雷恒鑫
金晨迪
ZENG Fulin;AN Wei;LI Jixing;CHEN Jia;REN Yingjie;HAN Mengna;LEI Hengxin;JIN Chendi(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China;Zhejiang Wazam New Materials Corporation,Hangzhou 311121,China)
出处
《电子工艺技术》
2022年第3期182-186,共5页
Electronics Process Technology
