摘要
芯片级节流制冷器(MMR)在冷却微小元件领域应用广泛,采用材料生长、减薄、键合及光刻刻蚀等微加工技术制成。最小的节流结构尺寸为1μm。本文对芯片级节流制冷器的最新结构进行了多目标、多结构参数的数值计算优化研究,对制冷器高压侧和低压侧换热器的换热和流动性能进行了优化,数值计算结果与文献中经验关联式吻合良好。计算结果表明:高压侧换热器的努塞尔数Nu较优化前提高了5.8%,摩擦因子f降低了25.7%;低压侧换热器的Nu较优化前提高了14.5%,f降低了2.3%。获得了Nu和f随各结构参数的变化规律,为芯片级节流制冷器换热器结构参数和性能优化提供了参考。
Microminiature refrigerator(MMR)is wildly used in micro element cooling area.It is fabricated by novel etching,material growing,thinning and bonding technologies.The minimum size of its restriction area can be 1μm.This paper presents a numerical optimization by employing the multi-objective method to obtain the best structural parameters with the goal of optimizing the MMRs high and low-pressure heat exchangers’heat transfer and pressure performance.The calculation results agree well with correlations in literature.The results showed that compared to the origin model the Nusselt number Nu is increased by 5.8%and friction factor f is decreased by 25.7%in optimized high-pressure heat exchanger model,as for the optimized low-pressure heat exchanger model the Nu is increased by 14.5%and f is decreased by 2.3%.The patterns of Nu and f change with structural parameters are also obtained.This paper provides a new approach of MMR heat exchangers simulation and offers theoretical reference to the performance optimization.
作者
童欣
邱杰
李家鹏
槐阳
陈俊元
谢坤圆
TONG Xin;QIU Jie;LI Jiapeng;HUAI Yang;CHEN Junyuan;XIE Kunyuan(Kunming Institute of Physics,Kunming 650223,China)
出处
《真空与低温》
2022年第3期324-332,共9页
Vacuum and Cryogenics
