摘要
在5G通信技术及消费电子行业快速发展的背景下,铜基薄壁热管被广泛应用于大功率电子设备散热领域。通过介绍目前应用较广的几种热管,对其结构、特点及应用范围进行了对比;阐述热管在加工制备和使用过程中存在的一些问题和缺陷,对表面缺陷形成机理进行分析,并对热管未来的发展趋势进行了展望。
In the context of the rapid development of 5th generation wireless systems and consumer electronics industry,the thinwalled heat pipe is widely used in high-power electronic equipment heat dissipation.This article describes several kinds of heat pipes,comparison of their structures,features and applications;describes some problems and defects in the process of processing and use,analyzes the formation mechanism of surface defects,and the future development trend of heat pipes.
作者
李洋
王松伟
刘劲松
张士宏
韩秋水
胡宽雨
LI Yang;WANG Song-wei;LIU Jin-song;ZHANG Shi-hong;HAN Qiu-shui;HU Kuan-yu(School of Materials Science and Engineering,Shenyang Ligong University,Shenyang 110159,Liaoning,China;Shi-Changxu Innovation Center for Advanced Materials,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,Liaoning,China;Guangdong Longfeng Precise Copper Tube Co.,Ltd.,Zhuhai 519090,Guangdong,China)
出处
《铜业工程》
CAS
2022年第2期1-7,共7页
Copper Engineering
基金
中国科学院重点部署项目(ZDRW-CN-2021-3)。
关键词
热管
散热技术
吸液芯
热管缺陷
表面质量
发展趋势
heat pipe
heat dissipation technology
suction core
heat pipe defect
surface quality
development trend
