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环氧树脂基导热复合材料的制备与性能研究 被引量:1

Preparation and properties of epoxy resin thermalconductive composites
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摘要 为探讨影响导热复合材料性能的关键,以片状六方氮化硼(H-BN)和球形氧化铝(Al_(2)O_(3))为填料,使用三辊开炼机共混制备环氧树脂(EP)基导热绝缘复合材料,选择鳞片石墨为对比实验的填料,制备非绝缘导热复合材料。研究填料种类和质量分数对复合材料导热性能、力学性能、介电性能、电阻率和热稳定性等的影响。结果表明:填料的加入能够显著提高复合材料的导热性能,当复配填料总量为120份(以每100 g计)时,H-BN和Al_(2)O_(3)质量比为8∶2时,复合材料的导热系数达0.899 W/(m·K),是纯EP的4.2倍。除对比组外,复合材料均具有较好介电性能、电阻率和热稳定性,是良好的绝缘材料。 To investigate the critical factors to influence the properties of composites,thermal conductive and electrical insulating epoxy resin(EP)composites were prepared by blending platelet H-BN and spherical Al_(2)O_(3) in the polymer matrix through a three roll mixing mill.Non-insulating thermal conductive EP composites were prepared by blending flake graphite in the polymer matrix as comparative experiment.The effects of filler content on thermal conductivity,mechanical properties,electric-insulation and thermal stability properties of EP composite were investigated.The results indicated that blending filler in the polymer matrix gave the composites higher thermal conductivity.When the total filler content is 120 Phr and the mass ratio of H-BN/Al_(2)O_(3) is 8∶2,the thermal conductivity of the composites reached 0.899 W/(m·K),which is 4.2 times higher than that of the neat EP.Meanwhile,the composites retained excellent dielectric properties,higher resistivity and thermal stability.The polymer matrix was excellent electrical insulating composites.
作者 刘升华 LIU Sheng-hua(NO.92941 PLA,Huludao 125000,Liaoning Province,China)
机构地区 [
出处 《化学工程》 CAS CSCD 北大核心 2022年第7期22-26,共5页 Chemical Engineering(China)
关键词 导热性能 环氧树脂 填充型 复合材料 thermal conductivity epoxy resin filling polymer composite
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  • 1周文英,张亚婷.本征型导热高分子材料[J].合成树脂及塑料,2010,27(2):69-73. 被引量:31
  • 2卢金荣,吴大军,陈国华.聚合物基导电复合材料几种导电理论的评述[J].塑料,2004,33(5):43-47. 被引量:49
  • 3Wan J W, Zhang W J, Bergstorm D J. An Analytical Mod-el for Predicting the Underfill Flow Characteristics in FlipChip Encapsulation[J]. IEEE Transactions on Advanced Pack-aging,2005,28(3):481-487.
  • 4Peterfish W G, Noddin D B, Hanson D A. High DensityOrganic Flip Chip Substrate Technology[C]//Electronic Com-ponents and Technology Conference, 1998:1089-1097.
  • 5Ishida H, Rimdusit S. Very High Thermal Conductivity Ob-tained by Boron Nitride-filled Polybenzoxazine[J]. Thermo-chimica Acta, 1988,320( I -2): 177-186.
  • 6Bae J, Kim W, Cho S, et al. The Properties of AlN-filledEpoxy Modeling Compounds by the Effects of Filler SizeDistribution!;:)]. J Mater Sci,2000,35(23):5907-5913.
  • 7Konzelmann S, Hoffmann C, Merte R. Thermal and Electri-cal Properties of Aluminum Nitride Filled Epoxy-resin Com-pound^]. IEEE Transactions on Dielectrics and Electrical In-sulation,2008,15(2):327-333.
  • 8Bruggeman DAG. Berechnung Verschiedener PhysikalisherKonstanten Von Heterogenen Substanzen[J]. Annalen derPhysik,1935,24(7):636-664.
  • 9Li Z, Okamoto K, Ohki Y, et al. Role of Nano-filler onPartial Discharge Resistance and Dielectric BreakdownStrength of Micro-ALO^/Epoxy Composites[C]//IEEE 9th In-ternational Conference on the Properties and Applications ofDielectric Materials,2009:735-756.
  • 10Nelson J K, Hu Y. Electrical Properties of Ti02 Nanocom-posites[C]//2003 Annual Report Conference on Electrical In-sulation and Dielectric Phenomena,2003:719-722.

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