摘要
触变剂赋予焊锡膏一定的触变性能。通过对同一种无铅焊锡膏配方更换不同触变剂的试验,研究了触变剂对焊锡膏坍塌性能的影响。测试结果表明:不同触变剂对焊锡膏的黏度、触变指数(Ti值)及坍塌性能影响较大,焊锡膏的坍塌性与触变剂的触变指数有一定的关联性。一般地,Ti值大于0.5的焊锡膏冷塌性能好,但不易印刷;触变指数小于0.4的焊锡膏冷塌性能差;触变指数在0.4~0.5的焊锡膏坍塌性能比较适中。
Thixotropic agent imparts certain thixotropic properties to solder paste,the effect of thixotropic agent on collapse property of solder paste is studied by changing different thixotropic agent for the same lead-free solder paste formula.The test results show that different thixotropic agents have great influence on the viscosity,thixotropic index and collapse property of solder paste,and the collapse property of solder paste has a certain correlation with the thixotropic index of thixotropic agent.Generally,the solder paste with thixotropic index greater than 0.5 has good cold collapse performance,but it is not easy to print,the solder paste with thixotropic index less than 0.4 has poor cold collapse performance,the solder paste with thixotropic index between 0.4 ~ 0.5 has moderate collapse performance.
作者
熊晓娇
武信
柳丽敏
何欢
王艳南
XIONG Xiaojiao;WU Xin;LIU Limin;HE Huan;WANG Yannan(Tin Products Manufacturing Co.,Ltd.of YTCL,Kunming 650501,China)
出处
《电子工艺技术》
2022年第5期302-305,共4页
Electronics Process Technology
关键词
触变剂
助焊剂
焊锡膏
坍塌性
thixotropic agent
flux
solder paste
collapse property
