摘要
为了实现面向汽车燃油蒸汽压力检测的压阻式微压传感器封装,应对其油污、振动的使用环境,减小封装结构应力对压敏芯片的影响,采用芯片背面承压,与电路集成在一块陶瓷基板上,再同塑料外壳组装成完整传感器的封装方式。通过仿真软件辅助设计,研究了贴片胶、外壳以及基板对压敏芯片的影响,确定了最优封装结构和参数,封装样品经过测试全温区最大误差约为1.2%FS,满足使用需求,通过这种封装方式降低了传感器的尺寸和成本。
In order to realize the packaging of piezoresistive micropressure sensor for automobile fuel steam pressure detection, the influence of the packaging structure stress on the pressure sensitive chip should be reduced to cope with the operating environment of oil pollution and vibration.The back pressure of the chip was adopted, and the circuit was integrated on a ceramic substrate, and then assembled into a complete sensor package with a plastic shell.Through simulation software aided design, the influence of the patch adhesive, shell and substrate on the pressure-sensitive chip was studied, and the optimal packaging structure and parameters were determined.The maximum error of the packaged sample was about 1.2%FS after testing, which met the requirements of use.The size and cost of the sensor were reduced through this packaging method.
作者
杜奋豪
王冰
薛立伟
刘雨墨
张雯霞
陈立国
DU Fen-hao;WANG Bing;XUE Li-wei;LIU Yu-mo;ZHANG Wen-xia;CHEN Li-guo(Robotics&Microsystem Center,School of Mechanical and Electrical Engineering,Soochow University,Suzhou 215021,China;Kunshan Shuangqiao Sensor Measurement Controlling Co.,Ltd,Kunshan 215325,China)
出处
《仪表技术与传感器》
CSCD
北大核心
2022年第8期15-19,共5页
Instrument Technique and Sensor
关键词
燃油蒸汽
压阻式压力传感器
有限元仿真
传感器封装
fuel steam
piezoresistive pressure sensor
finite element simulation
sensor package
