摘要
通过微机控制万能试验机、扫描电子显微镜(SEM)、X射线衍射仪(XRD)等手段对硫脲、四甲基硫脲、脲、乙烯硫脲等4种具有相似结构的添加剂在8μm锂电铜箔制备中的应用进行了研究。结果发现,同时具有C=S和─NH(或─NH─)分子结构的硫脲及乙烯硫脲可以提高抗拉强度到450 MPa以上,但会造成光泽降低;只具有上述其中一种结构的脲和四甲基硫脲对抗拉强度和光泽的影响较小。加入这4种添加剂都有使铜箔表面粗糙度增大的趋势,且铜箔仍保持(111)晶面择优取向。加入硫脲和脲对晶面择优取向影响较小,加入乙烯硫脲和四甲基硫脲后(200)和(220)晶面的织构系数分别降低至少一半和增加一倍以上。
The application of four types of additives with a similar structure i.e. thiourea, tetramethylthiourea, urea, and ethylene thiourea in preparation of 8 μm-thick lithium battery copper foil was studied by using microcomputer-controlled universal testing machine, scanning electron microscope(SEM), and X-ray diffractometer(XRD). The results showed that the addition of thiourea and ethylene thiourea with both C=S and ─NH(or ─NH─) groups improved the tensile strength to at least 450 MPa, but caused the reduction of gloss. Urea and tetramethylthiourea with only one of the said groups had little effect on tensile strength and gloss. The addition of each one of the four additives tended to increase the roughness. The copper foil retains the preferred orientation of(111) crystal plane after the addition of the said additives, and the addition of thiourea or urea had less effect on the preferred orientation. The texture coefficient of(200) plane was decreased by at least half while that of(220) plane was increased to more than two times after the addition of ethylene thiourea or tetramethylthiourea.
作者
宋言
朱若林
代泽宇
林毅
SONG Yan;ZHU Ruolin;DAI Zeyu;LIN Yi(Jiangxi Copper Technology Research Institute Co.,Ltd.,Nanchang 330096,China;Jiangxi Copper Corporation Co.,Ltd.,Nanchang 330096,China)
出处
《电镀与涂饰》
CAS
北大核心
2022年第17期1245-1249,共5页
Electroplating & Finishing
基金
江西省博士后科研择优资助项目。
关键词
电解铜箔
类硫脲添加剂
化学结构
抗拉强度
表面形貌
光泽
粗糙度
electrolytic copper foil
thiourea-like
chemical structure
tensile strength
surface morphology
gloss
roughness
