摘要
MLCC的开裂严重影响产品的可靠性。通过对陶瓷生坯的热重分析,得到合适的排胶曲线范围。进行一系列排胶曲线试验,比较电性能与可靠性水平,发现降低排胶温度能有效降低MLCC烧结后的开裂比例,并且容量、损耗因子、击穿电压及绝缘电阻无明显差异。同时进行高加速试验比较产品的可靠性,得到230℃排胶温度下的产品具有最大的平均失效时间,且失效分布的一致性最优。
The cracking problems of MLCC seriously affects the reliability of products.The optimized curve of binder burn-out(BBO)is obtained by studying the thermogravimetric analysis of ceramics green chips.A series of BBO tests are carried out to compare the electrical performance and reliability of MLCC.It is found that the cracking ratio reduced after sintering when the temperature of BBO decreased.There is no significant difference in capacity,loss factor,breakdown voltage and insulation resistance.The high acceleration test is conducted to compare the reliability of the products.It reveales that the products had the maximum average failure time at 230℃BBO temperature,and the consistency of failure distribution is the best.
作者
黄翔
敖宏
宋进祥
罗爱萍
HUANG Xiang;AO Hong;SONG Jinxiang;LUO Aiping(Guangdong Viiyong Electronic Technology Co.,Ltd.,Luoding 527200,China)
出处
《电子工艺技术》
2022年第6期345-348,共4页
Electronics Process Technology
关键词
开裂
排胶
热重分析
失效率
cracking
binder burn-out
thermogravimetry
failure rate
