摘要
为了研究多层陶瓷电容器开裂的失效机理,通过红外热像对电容的失效点进行定位,结合应力应变测试确认基板制造过程中引入的应变大小,采用仿真分析研究基板变形后电容本体的应变分布情况,利用板弯曲试验对电容进行故障复现。结果表明:在基板制造过程中功能测试环节会引起基板变形,变形幅度达到了1 mm,对应的应变大小约为1 000μE,在1 mm的板弯曲深度下,电容底部位置将形成裂纹,裂纹由瓷体表面向电容内部延伸,当裂纹贯穿其内部相邻不相连的内层电极时,会引起电容绝缘电阻的降低失效。基于多层陶瓷电容器裂纹的形成机理,提出相应的优化保护方法以提高电容器的可靠性。
In order to study the failure mechanism of the crack in multi-layer ceramic capacitor, the failure point of the capacitor is located through infrared thermal image, and the strain during substrate manufacturing is determined via stress-strain test. Furthermore, the strain distribution on the ceramic of the capacitor is simulated, and the failure is reappeared through board flex. The results show that the deformation of the substrate is 1 mm during the function test stage of substrate manufacturing, and the corresponding strain is about 1000 μE. When the bending depth reaches 1 mm, the crack will be formed at the bottom of the capacitor, extending from the surface to the interior of the ceramic. The insulation resistance of the capacitor will reduce when the crack extends through the adjacent inner electrode. Based on the formation mechanism of the crack in multi-layer ceramic capacitor, corresponding optimization methods are proposed to improve the reliability of the capacitor.
作者
黄义隆
林道谭
陈欢
邓晶
李晋伟
HUANG Yilong;LIN Daotan;CHEN Huan;DENG Jing;LI Jinwei(China Southern Power Grid Extra High Voltage Transmission Company,Maintenance and Test Center,Guangzhou Guangdong 510670,China;The Fifth Electronics Research Institute of Ministry of Industry and Information Technology,Guangzhou Guangdong 511370,China)
出处
《电子器件》
CAS
北大核心
2022年第5期1071-1076,共6页
Chinese Journal of Electron Devices
关键词
多层陶瓷电容器
裂纹
失效分析
板面变形
multi-layer ceramic capacitor
crack
failure analysis
board flex
