摘要
将平均晶粒度分别为30、70和150μm的3块6N高纯纯铜方靶放在同一溅射系统中进行溅射,并检测和观察溅射后 I-V特征曲线、质量损失以及所镀薄膜的表面形貌、厚度以及X射线衍射谱。结果表明,晶粒度作为靶材的一个重要参数指标,会影响靶材溅射后表面形貌和I-V特性曲线。当所镀薄膜较厚时,靶晶粒度并不会对靶的质量损失以及薄膜结晶情况产生太大的影响,但会对薄膜沉积率产生较大影响。
Three 6 N high-purity copper square targets with average grain sizes of 30μm,70μm and 150μm respectively were placed in the same sputtering system for sputtering.The I-V characteristic curve,mass loss,and surface morphology,thickness and X-ray diffraction pattern of the coated film were detected and observed after sputtering.The results show that the grain size,as an important parameter of the target,affects the surface morphology and I-V characteristic curve of the target after sputtering.When the deposited film is thicker,the target grain size doesn’t have much influence on mass loss of the target and the film crystallization,but the film deposition rate appears to be quite different.
作者
王帅康
唐宾
鲍明东
展尚松
王铎
易晨曦
Wang Shuaikang;Tang Bin;Bao Mingdong;Zhan Shangsong;Wang Duo;Yi Chenxi(College of Material Science and Engineering,Taiyuan University of Technology,Taiyuan Shanxi 030024,China;School of Materials and Chemical Engineering,Ningbo University of Technology,Ningbo Zhejiang 315211,China;College of Material Science and Engineering,Chang'an University,Xi'an Shaanxi 710061,China)
出处
《金属热处理》
CAS
CSCD
北大核心
2022年第11期261-265,共5页
Heat Treatment of Metals
基金
宁波市“科技创新2025”重大专项(2018B10066)。
关键词
磁控溅射
铜靶
靶晶粒度
溅射性能
沉积性能
magnetron sputtering
copper target
target grain size
sputtering performance
deposition performance
