摘要
随着现代工业的快速发展,SiC/Cu复合材料以其优异的导电性、高强度、导热性等在电子封装领域有着巨大的应用前景。通过化学镀与粉末冶金法成功制备了高体积分数β-SiC@Cu/Cu复合材料,并通过金相显微镜、XRD、SEM等分析手段对其物相、微观组织和热膨胀系数进行了表征。结果表明:随着SiC体积含量的增加,β-SiC@Cu/Cu复合材料的致密度、抗弯强度均减小,而复合材料的硬度随之增大;β-SiC@Cu/Cu复合材料的抗弯强度达在70 MPa以上,热膨胀系数为4.5×10^(-6)~10.0×10^(-6)/℃,满足现代电子封装材料性能要求。
With the rapid development of modern industry,SiC/Cu composites have great application prospect in electronic packaging due to their excellent conductivity,high strength and thermal conductivity.In this paper,high-volume-fractionβ-Sic@Cu/Cu composites were successfully prepared by electroless plating and powder metallurgy method,and their phase,microstructure and thermal expansion coefficient were characterized by metallographic microscope,XRD and SEM.Results showed that with the increase of SiC volume fraction,the density and flexural strength ofβ-SiC@Cu/Cu composites decreased,while the hardness of the composites increased.Moreover,the flexural strength ofβ-SiC@Cu/Cu composites was over 70 MPa,the thermal expansion coefficient was 4.5×10^(-6)~10.0×10^(-6)/℃,which met the performance requirements of modern electronic packaging materials.
作者
张强
杨成刚
姚波
吴集思
钱文
ZHANG Qiang;YANG Cheng-gang;YAO Bo;WU Ji-si;QIAN Wen(School of Aeronautical Manufacturing Engineering,Nanchang Hangkong University,Nanchang 330063,China;Department of Aeronautical Mechanical Engineering,Chinese People’s Liberation Army Aviation School,Beijing 101123,China)
出处
《材料保护》
CAS
CSCD
2022年第12期125-131,共7页
Materials Protection
基金
国家自然科学基金(51765046)
江西省重点研发计划一般项目(20202BBE53001)资助。
关键词
SiC
铜基复合材料
化学镀
冶金粉末
抗弯强度
热膨胀系数
SiC
copper matrix composite
electroless plating
metallurgical powder
flexural strength
thermal expansion coefficient
