摘要
介绍了三维集成微波组件的典型集成架构及其特点,综述了三维集成微波组件基板技术、垂直互连及热设计等关键技术研究现状,对主要技术性能进行了对比分析。介绍了三维集成微波组件可靠性理论与技术研究进展及后续研究方向。分析了三维集成微波组件技术发展趋势,提出了重点技术攻关方向建议,并对三维集成微波组件技术发展和应用前景进行了预测。
The typical integration architectures as well as their features of three-dimensional integrated microwave modules are introduced.The research states of key technologies including substrates,vertical interconnections and thermology design are reviewed.The performances of each technology approaches are compared.The reported and successive research works about theories and technologies of reliability are introduced.The technical development trends are analyzed and the preferred directions of technical breakthrough are proposed.The prospects of technical developments and applications are predicted.
作者
黄建
HUANG Jian(Southwest China Institute of Electronic Technology,Chengdu 610036,China)
出处
《电讯技术》
北大核心
2023年第1期137-144,共8页
Telecommunication Engineering
关键词
三维集成
微波组件
异质集成
垂直互连
应用前景
three-dimensional integration
microwave module
heterogeneous integration
vertical interconnection
application prospect
