摘要
根据电子设备工作时局部热耗过大的状况,设计了小通道液冷冷板。利用ICEPAK仿真软件,分别对小通道冷板和普通S型流道冷板进行散热性能研究,研究发现小通道冷板的散热效果明显优于普通S型流道冷板。对小通道结构参数(肋片间距、厚度)及进口处流量进行单因素分析,研究其对冷板散热性能的影响。通过正交试验的极差分析,各因素的影响顺序为:进口流量>肋片厚度>肋片间距。该分析结果为高功耗电子设备的散热设计提供理论参考。
Aiming at the situation that the local heat consumption in an electronic equipment is too large, a small channel liquid-cooled cold plate is designed. The heat dissipation performance of the small channel cold plate and the ordinary Stype runner cold plate are studied by ICEPAK simulation software. The study finds that the heat dissipation effect of the small channel cold plate is more significant. The factors affecting the heat dissipation performance of the liquid cold plate(fin spacing, thickness) and the inlet flow are simulated and analyzed. Through the range analysis of the orthogonal experiment, the order of influence of the above factors is inlet flow>fin thickness>fin spacing, which provides a theoretical reference for the heat dissipation design of high-power electronic equipment.
作者
赵如意
ZHAO Ruyi(Changzhou Institute of Technology,Changzhou 213127,China)
出处
《机械工程师》
2023年第1期15-17,共3页
Mechanical Engineer
关键词
ICEPAK
肋片
散热性能
正交试验
高功耗
ICEPAK
fin
heat dissipation performance
orthogonal experiment
high power consumption
