摘要
随着半导体器件向着微型化、高度集成化及高功率密度方向发展,其发热量急剧增大,热失效已经成为阻碍微电子封装器件性能和寿命的首要问题.高性能的热管理材料能有效提高微电子封装内部元器件散热能力,其中封装结构散热路径上的热界面材料(Thermal Interface Material,TIM)便是热管理中至关重要的环节.通过热界面材料填充器件热源和散热单元之间的空隙,可以大幅度降低接触热阻,增加热量的传递效率.对微电子封装而言,高性能的热界面材料不仅需要高的导热系数以降低封装热阻,还需具备一定的压缩性以弥补封装的装配偏差,然而通常很难兼顾上述两种特性.本文重点关注微电子封装中热界面材料,系统地梳理了目前热界面材料的常见类型、应用存在问题、关注研究热点和国内外发展现状.
With the development of semiconductor devices toward miniaturization,high integration and high power density,the calorific value increases sharply.Thermal failure becomes the primary problem hindering the perfbnnance and life of microelectronic devices.High-performance thermal management materials can effectively help microelectronic components to dissipate heat.The thermal interface material(TIM)on the heat dissipation path of packaging structure is a crucial part in the thennal management.By filling the gap between the heat source and the cooling unit,TIM can reduce the contact thermal resistance and improve heat transfer efficiency.For microelectronic packaging,high-performance thermal interface materials not only need high thermal conductivity to reduce the thermal resistance of packaging,but also need a certain compressibility to make up for the assembly deviation of packaging.However,it is often difficult to take into account the above two characteristics.This paper focuses on the thermal interface material in microelectronics packaging,systematically summarizes the common types of thermal interface materials,existing problems in application,research hotspots and development status at home and abroad.
作者
杨宇军
李逵
石钰林
焦斌斌
张志祥
匡乃亮
YANG Yujun;LI Kui;SHI Yulin;JIAO Binbin;ZHANG Zhixiang;KUANG Nailiang(Xi'an Institute of Microelectronics Technology,Xi'an 710000,China;Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China)
出处
《微电子学与计算机》
2023年第1期64-74,共11页
Microelectronics & Computer
关键词
微电子封装
热管理
热界面材料
导热系数
热阻
Microelectronic packaging
thermal management
thermal interface materials
heat conductivity
thermal resistance
