摘要
采用分离变量法和奇异积分方程研究了在热冲击作用下复合热电薄膜/基底结构的热-电-力耦合行为及薄膜边缘应力集中问题.得到了复合薄膜温度场以及层间热应力分布,给出了应力强度因子表达式.分析了在热冲击作用下复合薄膜尺寸、材料参数配比和界面漏电行为对应力强度因子的影响规律.结果表明,复合热电薄膜越薄,边缘处的热应力集中越弱;在高温侧选择塞贝克系数较大,热导率较低且电导率较低的热电材料,可以有效降低其层间热应力;界面漏电会降低复合热电薄膜层间热应力.研究结果将为热电薄膜器件的结构设计及安全使用提供理论指导.
Based on the separation variable method and the singular integral equation, the thermal-electrical-mechanical coupling behavior of the segmented thermoelectric thin film/substrate under thermal shock is studied and the stress concentration at the edge of the thin film is analyzed. The temperature field and interfacial thermal stress distribution are obtained, and the expressions of stress intensity factors are given. The effects of segmented film dimensions, material parameters and interface leakage behavior on the stress intensity factors are analyzed. The results show that a thinner segmented film thickness corresponds to a lower thermal stress concentration. In order to effectively reduce the interfacial thermal stress concentration, a high Seebeck coefficient, a low thermal conductivity and a low electrical conductivity of thermoelectric thin film at hot side should be selected. In addition, the interface leakage can reduce the interfacial thermal stress. These results can provide theoretical guidance for the structural design and application safety of the thermoelectric thin film devices.
作者
刘畅
刘越
辛绍杰
LIU Chang;LIU Yue;XIN Shaojie(School of Mechanical Engineering,Shanghai Dianji University,Shanghai 201306,China)
出处
《力学季刊》
CAS
CSCD
北大核心
2022年第4期803-811,共9页
Chinese Quarterly of Mechanics
基金
国家自然科学基金(12202259)
上海市“扬帆计划”(20YF1414500)
上海市“晨光计划”(20CG69)。
关键词
复合热电薄膜
热冲击
热-电-力耦合
分离变量法
奇异积分方程
segmented thermoelectric films
thermal shock
thermal-electrical-mechanical coupling
separation of variables
singular integral equation
