摘要
在Gleeble-1500型热模拟机上,对弥散强化铜进行高温变形试验,观察显微组织并分析其变形行为。结果表明:在变形初始阶段材料流动应力迅速达到最大值,随着温度的升高应变速度逐渐降低,应力不出现明显的下降趋势;弥散相显著提高再结晶温度,高温变形过程未发生明显的再结晶现象,动态回复为主要的软化机制;1.2%Al_(2)O_(3)-0.4%WC弥散强化铜的高温本构方程为:σ=A√2R^(2)-1ε^(-n)ε^(-m)e^(-br),其中,A=1049.8,R=0.93,n=-0.1763,m=0.2406,b=0.0028(T为绝对温度)。
The deformation behavior of dispersion-strengthened copper(1.2 % Al_(2)O_(3)-0.4 % WC)was experimentally studied by hot compression simulation tests on a Gleeble-1500 thermal-mechanical simulator. The deformation microstructure at high temperature was also studied. The result shows that at the beginning of hot compression simulation the flowing stress of the dispersion-strengthened copper attains a peak value soon and when the temperature is higher and the strain rate is slower, the downward trend of stress is greater. The dispersion particles raise recrystallization temperature obviously. Dynamic recovery is a main softening way under experimental conditions. The constitutive equation at high temperature of 1.2 % Al_(2)O_(3)-0.4 % WC/Cu is,σ=A√2R^(2)-1ε^(-n)ε^(-m)e^(-br),n=-0.1763, m=0.2406, b=0.0028(T is absolute temperature).
作者
郑森琳
罗云
Zheng Shenlin;Luo Yun(School of Mechanical Engineering,Hunan Institute of Science and Technology,Yueyang 414006,China)
出处
《广东化工》
CAS
2022年第24期29-32,共4页
Guangdong Chemical Industry
基金
国家级大学生创新创业训练计划项目:铜基复合材料的制备及性能分析(S202010543036)
湖南省教育厅一般项目:弥散强化铜的制备及高温变形行为研究(19C0851)。
关键词
弥散强化铜
热模拟
流动应力
显微组织
本构方程
dispersion-strengthened copper
thermal simulation
flowing stress
microstructure
constitutive equation
