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高功率电子元件冲击射流冷却的模拟研究 被引量:1

Simulation Study on Impingement Jet Cooling of High-power Electronic Components
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摘要 本文采用数值模拟的方法,针对空气冲击射流冷却装置的冷却换热过程建立模型,并以实验测得的温度分布验证模型的可靠性。通过模型,模拟研究了空气冲击射流冷却中射流温度、射流速度、喷嘴直径对换热特性的影响。结果表明:射流温度越高、射流速度越大,壁面温度分布越均匀;不同射流温度的表面传热系数均沿径向先增大后减小,在r=0~1.87 mm区间内的换热效果基本不受射流温度的影响,在r=1.87~7.00 mm区间内表面传热系数随射流温度的升高而增大;射流速度越大,表面传热系数越大;喷嘴直径在1.2~2.2 mm,射流速度一定时,喷嘴直径增大,温度分布越均匀、换热越均匀,平均传热系数随着喷嘴直径的增大而增大。 In this paper, the numerical simulation method is used to establish a model for the cooling and heat transfer process of the air impingement jet cooling device, and the reliability of the model is verified by the temperature distribution measured by the experiment. Through the model, the effect of jet temperature, jet velocity and nozzle diameter on heat transfer characteristics in air impingement jet cooling are studied. The results show that the higher the jet temperature and the higher the jet velocity, the more uniform the wall temperature distribution is;the surface heat transfer coefficients of different jet temperatures increase first and then decrease along the radial direction. The heat transfer effect in the range of r=0-1.87 mm is basically not affected by the temperature of the jet.The heat transfer coefficient increases with the increase of the jet temperature in the range of r=1.87-7.00 mm;the greater the jet velocity, the greater the surface heat transfer coefficient;when the nozzle diameter is 1.2-2.2 mm and the jet velocity is constant, the nozzle diameter increases, the temperature distribution and the heat exchange are more uniform. The average heat transfer coefficient increases with the increase of the nozzle diameter.
作者 吕静 刘建平 黄伶俐 刘洪芝 LYU Jing;LIU Jianping;HUANG Lingli;LIU Hongzhi(School of Environment and Architecture,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处 《制冷技术》 2022年第6期23-28,共6页 Chinese Journal of Refrigeration Technology
基金 国家自然科学基金(No.51906157)。
关键词 电子元件 冲击射流 数值模拟 换热特性 Electronic components Impinging jet Numerical simulation Heat transfer characteristics
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