摘要
倒装芯片球栅格阵列(FCBGA)基板是人工智能、5G、大数据、高性能计算、智能汽车和数据中心等新兴需求应用的CPU、图形处理器(GPU)、FPGA等高端数字芯片的重要载体,业界对其需求量快速增长。对FCBGA基板的关键技术进行了介绍,包括精细线路技术、翘曲控制技术和局部增强技术。同时,对FCBGA基板技术的发展趋势及应用前景进行了展望。
Flip-chip ball grid array(FCBGA)substrate,as an important carrier of high-end digital chips such as CPU,GPU,FPGA,have been very popular in high-end applications,including artificial intelligence,5G,big data,high-performance computing,smart cars,and data centers,and the industry demand is growing rapidly.The key technologies of FCBGA substrate are introduced,including fine-line process,warpage control technology and local enhancement technology.At the same time,the development trend and application prospect of FCBGAsubstrate technology are prospected.
作者
方志丹
于中尧
武晓萌
王启东
FANG Zhidan;YU Zhongyao;WU Xiaomeng;WANG Qidong(Institute of Microelectronics,Chinese Academy of Sciences,Beijing 100029,China)
出处
《电子与封装》
2023年第3期23-31,I0003,共10页
Electronics & Packaging
基金
中国科学院战略性先导科技专项资助(XDA0330200)。
关键词
倒装芯片球栅格阵列
味之素增层膜
半加成工艺
翘曲
嵌入式多芯片互连桥
flip-chip ball grid array
Ajinomoto build-up film
semi-additive process
warpage
embedded multi-die interconnect bridge
