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覆铜板半固化环氧树脂热分解行为

Study on Thermal Decomposition Behavior of Semi-cured Epoxy Resin in Copper Clad Plates
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摘要 采用热重分析(TG)以不同的升温速率(5、10、15、20、30℃/min)分别在氮气气氛和空气气氛下对覆铜板中双氰胺固化环氧树脂热分解行为进行了研究,讨论不同升温速率以及不同气氛下双氰胺固化双酚A环氧树脂的热分解行为的变化。研究发现环氧树脂的TG曲线随升温速率的提高移向高温区,说明热分解温度随升温速率的增加而上升。DTA曲线的峰顶随着升温速率的增加移向高温段,说明受热分解所需达到的温度更高。氮气气氛下环氧树脂只有一个阶段的受热分解且其分解放热量较小,而空气气氛下环氧树脂则分两个阶段进行且其分解放热量高,主要集中在第二阶段放热,说明环氧树脂在空气气氛下与空气中的成分发生了复杂的热分解反应。 In this paper, thermal decomposition behavior of dicyandiamide cured epoxy resin in copper clad plate was studied by thermogravimetric(TG) analysis at different heating rates(5、10、15、20、30 ℃/min) in nitrogen atmosphere and air atmosphere respectively. The thermal decomposition behaviors of bisphenol A epoxy resin cured by dicyandiamide under dif ferent heating rate and different atmosphere were discussed. The study found that the TG curves of epoxy resin moved to the high temperature region with the increase of the heating rate, indicating that the thermal decomposition temperature increased with the increase of heating rate. The peak of DTA curve moved to the high temperature region with the increase of the heating rate, indicating that the thermal decomposition required for higher temperature. The thermal decomposition of epoxy resin in nitrogen atmosphere was only one stage with less heat releasing. In the air atmosphere, the thermal decomposition of epoxy resin was divided into two stages and its decomposition heat was high, which was attributed to concentrated heat release in the second stage. It also showed that the epoxy resin had a complex thermal decomposition reaction with the components in the air.
作者 李标 管妮 LI Biao;GUANG Ni(Gugangzhou Synthetic Materials Research Institute Co.Ltd.,Guangzhou 510665,Guangdong,China)
出处 《合成材料老化与应用》 2023年第1期35-36,58,共3页 Synthetic Materials Aging and Application
关键词 覆铜板中双氰胺固化环氧树脂 热分解行为 热分解速率 放热量 dicyandiamide cure epoxy resin in copper clad laminate thermal decomposition behavior thermal decomposition rate output of heat
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