摘要
为探究Cu-Al复合材料界面对室温环境下导热性能的影响,通过研究热处理工艺条件对Cu-Al复合材料界面扩散层影响规律,揭示Cu-Al复合板导热机制。研究表明,当Cu、Al厚度比为1∶1,退火温度为400℃时,Cu-Al复合材料室温条件下热导率为37.26 W/(m·K),其导热性能最好,界面的扩散相主要为AlCu和Al 2Cu。在400℃退火热处理下,传热方式主要受界面结构影响,界面产生中间相的数量影响复合板导热性能,趋近于两种不同材质中间区域。随着保温时间延长,AlCu相增多,对于薄壁件其室温导热性能受界面组分影响较大。通过流延法所制备的Cu-Al复合板热处理后界面光滑、平整,热处理后界面层扩散明显。
This paper is an effort to investigate the influence of Cu-Al composite interface on the thermal conductivity in room temperature environment.The study reveals the heat conduction mechanism of copper-aluminum composite through the influence of heat treatment process conditions on the diffusion layer of copper-aluminum composite plate.The results show that the thermal conductivity of copper-aluminum composite plate is 37.26 W/(m·K)at room temperature,when the thickness ratio between copper and aluminum is 1∶1,and the annealing temperature is 400℃,as which performs the best thermal conductivity with main AlCu and Al 2Cu as the diffusion phases.The heat transfer mode is mainly affected by the interface structure annealed at 400℃.And the number and quantity of mesophase produced at the interface affect the thermal conductivity of the composite plate,approaching to the intermediate region of two different materials.With the prolongation of heating time,the AlCu phase increases.For thin-walled parts,the thermal conductivity at room temperature is greatly affected by the interface components.The interface of Cu-Al laminated composites prepared by the flow-casting method is smooth and flat,and the diffusion of the interface layer is obvious after heating treatment.
作者
张海礁
吴迪
Zhang Haijiao;Wu Di(School of Materials Science&Engineering,Heilongjiang University of Science&Technology,Harbin 150022,China)
出处
《黑龙江科技大学学报》
2023年第2期180-185,共6页
Journal of Heilongjiang University of Science And Technology
关键词
Cu-Al复合材料
界面
热性能
Cu-Al laminated composites
interface
thermal properties
