摘要
目的:评估半导体激光辅助治疗下颌磨牙Ⅱ度根分叉病变的临床疗效。方法:纳入选取2022年1月-2022年3月就诊于笔者医院的40例下颌磨牙Ⅱ度根分叉病变患者(共40颗患牙),以随机数字表法分为两组。对照组单纯行龈下刮治和根面平整术(Subgingival scaling and root planing,SRP),试验组在对照组治疗基础上,行SRP前后均使用980 nm半导体激光行袋内照射。以超声龈上洁治术后1周为基线,比较两组治疗后即刻疼痛程度,治疗后8周、12周、24周的牙周临床指标[牙周袋探诊深度(Pocket depth,PD)、出血指数(Bleeding index,BI)、临床牙周附着丧失(Clinical attachment loss,CAL)、牙周袋水平探诊深度(Horizontal probing depth,HPD)]及术前和术后24周影像学指标[水平骨丧失(Bone loss in the horizontal direction,BL-H)、垂直骨丧失(Bone loss in the vertical direction,BL-V)]。结果:治疗后即刻试验组疼痛评分低于对照组,差异有统计学意义(P<0.05)。与基线相比,两组治疗后8周、12周、24周各项牙周临床指标和影像学指标显著改善。两组患者在治疗后8周、12周、24周BI和PD水平均低于基线水平,差异有统计学意义(P<0.05);试验组PD在治疗后12周、24周低于对照组,差异有统计学意义(P<0.05);治疗后8周、12周、24周两组HPD均显著改善,实验组HPD低于对照组,差异有统计学意义(P <0.05)。两组的BI和CAL比较差异无统计学意义(P>0.05)。两组患者治疗后24周BL-H均低于基线水平,差异有统计学意义(P<0.05),试验组BL-H低于对照组,差异有统计学意义(P<0.05);治疗后两组BL-V均降低,但差异无统计学意义(P>0.05)。结论:半导体激光在辅助SRP治疗下颌磨牙Ⅱ度根分叉病变时,能减少SRP治疗的疼痛感,有效降低牙周袋探诊深度,增加附着水平,是对根分叉病变牙周非手术治疗方案的有效补充,是一种安全、舒适、有效的辅助治疗方法。
Objective To evaluate the clinical effcacy of diode laser in the treatment of chronic periodontitis with periodontal degreeⅡfurcation involvement in mandibular molars.Methods Forty patients(40 teeth)with chronic periodontitis with mandibular molar periodontal degreeⅡfurcation involvement who attended the author's hospital from January 2022 to March 2022 were selected and randomly divided into two groups by random number table method.The control group was treated with subgingival scaling and root planing SRP alone,while the experimental group was treated with 980 nm diode laser before and after SRP.At one week after ultrasonic scaling as a baseline,the two groups were compared for immediate post-treatment VAS score,periodontal clinical indicators at 8,12 and 24 weeks post-treatment[pocket depth(PD),bleeding index(BI),clinical attachment loss(CAL),horizontal probing depth(HPD)]and preoperative and 6-month postoperative imaging indices[bone loss in the horizontal direction(BL-H),bone loss in the vertical direction(BL-V)].Results The VAS score was significantly lower in experimental group than in control group(P<0.05).Both treatments significantly reduced the periodontal clinical indexes and imaging indexes in the diseased teeth with periodontal degreeⅡfurcation involvement.BI and PD were lower than baseline levels at 8,12 and 24 weeks after treatment in both groups,with statistically significant differences(P<0.05).The reduction of PD in the experimental group at weeks 12 and 24 was significantly than control group(P<0.05).Also,the reduction of HPD in the experimental group at 8,12 and 24 weeks after treatment was statistically compared to the control group(P<0.05).However,there was no difference in BI and CAL between the two groups(P<0.05).At 24 weeks after treatment,the level of BL-H in the experimental group was statistically lower than the control group(P<0.05),while there was no significant difference of BL-V between the two groups(P>0.05).Conclusion Diode laser is a safe,comfortable,and clinically effective means when assisting SRPin the treatment of periodontal degreeⅡfurcation involvement.
作者
迪丽娜尔·艾尔肯
马乐
古丽努尔·阿吾提
Diinaer·AIERKEN;MA Le;Guinuer·AWUTI(Department of periodontal and Mucosal,the First Affliated Hospital of Xinjiang Medical University(the Affliated Stomatology Hospital of Xinjiang Medical University),Urumqi 830054,Xinjiang,China;Stomatology Disease Institute of Xinjiang Uyghur Autonomous Region,Urumqi 830054,Xinjiang,China)
出处
《中国美容医学》
CAS
2023年第4期147-151,共5页
Chinese Journal of Aesthetic Medicine
基金
新疆维吾尔自治区卫生与健康适宜技术推广项目(编号:SYTG-202115)。
关键词
半导体激光
牙周非手术治疗
慢性牙周炎
根分叉病变
下颌磨牙
diode laser
non-surgical treatment
chronic periodontitis
furcation involvement
mandibular molar
