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基于JC-Z05石英的薄膜电路基板工艺适用性研究 被引量:1

Study on the Process Suitability of Thin-film Circuit Substrate Based on JCZ05 Quartz
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摘要 为满足低损耗的设计需求,太赫兹微波组件中一般使用熔融石英基板。不同于光学系统对熔融石英材料的要求,应用于太赫兹等高频段微波组件的熔融石英基板材料不仅需要具备稳定的介电性能,还需要更优异的表面镀膜特性与电路图形、外形等加工精度要求。本文基于薄膜电路制造工艺要求,针对JC-Z05石英基板膜层附着力、表面刻蚀精度、切割质量、粘接强度等关键工艺特性研究,并通过改进工艺参数,进一步优化JC-Z05石英基板工艺适用性,提升国产石英基板材料作为在太赫兹频段薄膜电路制备的可靠性。研究结果表明,国产化熔融石英基板,结合优化后的薄膜电路制作工艺,制作出的电路具有膜层附着力强、外形切割公差小以及粘接可靠性高的特点,可满足复杂宇航环境中的高可靠应用。这一工作可为后续熔融石英电路基板在太赫兹领域的应用提供参考。 In order to meet the design requirements of low loss,fused quartz substrate was commonly used in terahertz microwave modules.Different from the requirements of optical system for fused quartz materials,the fused quartz substrate materials used in terahertz high frequency microwave modules not only need to have stable dielectric properties,but also need better surface coating characteristics and processing accuracy such as circuit graphics and shape.Based on the thin film circuit manufacturing process requirements,the key technologies of the coating adhesion,surface etching precision,cutting quality,bonding strength characteristics of the JC-Z05 quartz substrate were researched.By improving the process parameters,the technology applicability of the JC-Z05 quartz substrate was further improved.At the same time,the thin film circuit reliability of the domestic quartz substrate materials was improved in the terahertz frequencies fields.The results show that the circuit made by fused quartz substrate,combined with the optimized manufacturing process of thin film circuit,has the characteristics of strong adhesion of film layer,small shape cutting tolerance and high bonding reliability,which can meet the high reliability application in complex aerospace environment.The good suggestions for the subsequent application of fused quartz substrate in the field of terahertz are provided in this word.
作者 张楠 王平 何凯晨 王婷婷 赵炜 任联锋 ZHANG Nan;WANG Ping;HE Kaichen;WANG Tingting;ZHAO Wei;REN Lianfeng(China Academy of Space Technology(Xi'an),Xi'an 710100;China Academy of Space Technology,Beijing 100094)
出处 《宇航材料工艺》 CAS CSCD 北大核心 2023年第2期49-54,共6页 Aerospace Materials & Technology
关键词 太赫兹 石英基板 薄膜电路 Terahertz Quartz substrates Thin film circuits
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