摘要
金丝材料应用于航天器小型化微波模块等产品的电路封装中,金丝键合界面受高低温环境影响易产生性能变化从而影响服役可靠性。本文对金丝界面高低温特性的演化规律进行了研究,包括空间温度环境模拟试验后的界面与成分迁移、界面层厚度变化、键合金丝拉伸剪切力与失效模式演变,得出不同温度条件处理后的金铝键合界面微观组织变化规律。结果表明高低温循环试验后金丝界面仍保持较高的结合强度,一定程度的金属间化合物生长提高了键合界面强度。高温贮存试验中,随着贮存时间的增加,金丝界面层IMC(Intermetallic Compound)厚度和金属间化合物不断增长,失效破坏位置越来越多地出现在键合界面处,铝金属化层附近的金含量因扩散而增高,金铝键合界面处IMC界面层厚度的增加降低了界面结合强度。
The gold wire was used in the circuit packaging interconnection of spacecraft miniaturized microwave module and other products.The performance of gold wire bonding interface was easy to change because of the influence of space high and low temperature environment,thus affecting the service reliability.In this paper,the evolution of high and low temperature characteristics of the gold wire interface was studied,including the composition and interfacial migration,interfacial layer thickness change,tensile shear force and failure mode evolution of gold wire bonding after space environmental simulation tests,and the change rule of microstructure of Au-Al bonding interface under different temperature environment was obtained.The results show that the gold interface still maintain high bonding strength after the high and low temperature cycle test.A certain degree of intermetallic compound growth can improve the strength of bonding interface.But in the high temperature storage test,as time increases,the gold IMC(Intermetallic Compound)interface layer and the intermetallic compound increase rapidly,and failure damage positions increasingly appear in the bonding interface.The gold content near the aluminum metallized layer increases as a result of diffusion,the interface bonding strength reduces with the increase of the thickness of IMC interface layer at the Au/Al bonding interface.
作者
孔静
李岩
高鸿
刘媛萍
张磊
阎晓蕾
朱旭斌
KONG Jing;LI Yan;GAO Hong;LIU Yuanping;ZHANG Lei;YAN Xiaolei;ZHU Xubin(China Aerospace Components Engineering Center,China Academy of Space Technology,Beijing 100094;China Academy of Space Technology(Xi'an),Xi'an 710000;Project Management Center of Equipment Department and Space System Department of Strategic Support Force,Beijing 100074;Aerospace Standardization Technology Research Institute,Beijing 100071)
出处
《宇航材料工艺》
CAS
CSCD
北大核心
2023年第2期67-73,共7页
Aerospace Materials & Technology
关键词
微波电路
金丝
界面特性
高低温
金属间化合物
Microwave circuits
Gold wire
Interface properties
High and low temperature
Intermetallic compounds
