摘要
高导热AlN陶瓷是新型功率电子器件重要的基板材料,在5G通讯、微波TR组件、IGBT模块等高端电子器件领域具有广泛的应用。综述了国内外电子封装用高导热AlN陶瓷基板及其制备技术的研究进展。探讨了晶格氧、非晶层、AlN晶粒尺寸、晶界相及气孔等微结构因素对AlN陶瓷热导率的影响。提出选用高纯超细AlN粉体原料,合理选取烧结助剂的类型与添加量,优化排胶、高温烧结与热处理工艺是改善AlN陶瓷结构,实现AlN陶瓷热导率提升的有效途径。
High-thermal-conductivity AIN ceramics are important substrate materials in new-style power electronic devices,and widely used in 5G communication,microwave TR modules,IGBT modules,and other high-end electronic devices.In this paper,research progress around the world on the AlN ceramic substrates and their fabrication technologies for electronic packaging are reviewed.Influences of the microstructural factors such as lattice oxygen,amorphous layer,grain size,grain-boundary phase and pores on the thermal conductivity of AiN ceramics are discussed.The following effective ways such as the use of high purity ultra-fine AIN powder materials,the choice of rational additive type and amount,and the optimization of the debinding,high temperature sintering and heat treatment process are recommended to improve the microstructure and thermal conductivity of the AlN ceramics.
作者
郑瑞剑
魏鑫
张浩
汤志桓
许海仙
崔嵩
李京伟
汤文明
ZHENG Rujian;WEI Xin;ZHANG Hao;TANG Zhihuan;XU Haixia;CUI Song;LI Jingwei;TANG Wenming(School of Materials Science and Engineering,Hefei University of Technology,Hefei 230009,China;Hefei Shengda Electronic Technology Industry Co.Ltd.,Hefei 230088,China;43 Institute,China Electronics Technology Group Corporation,Hefei 230088,China;Anhui Province Key Laboratory of Microsystem,Hefei 230088,China)
出处
《中国陶瓷》
CAS
CSCD
北大核心
2023年第5期1-14,49,共15页
China Ceramics
基金
国家大学生创新项目(No.202110359011)
安徽省重点研发与开发计划(No.202004a05020022)
安徽省科技重大专项(No.202003a05020006)。
关键词
电子封装
AlN陶瓷基板
热导率
显微结构
制备技术
Electronic packaging
AIN ceramic substrates
Thermal conductivity
Microstructure
Fabrication technology
