摘要
针对弹载平台严苛的空间尺寸和重量设计要求,提出了一种前端天线阵面采用一体化片式可扩充天线模块,后端综合射频单元、综合处理单元以及电源单元采用模块高集成化设计,模块间采用射频和低频连接器混合盲配互连的结构设计方法。一体化片式可扩充天线模块的应用使得天线阵面具备二维拓展功能,同时结合高低频混频盲配互联技术,可有效降低天线阵面的剖面高度,满足18.5g高量级振动使用要求,并可在50℃初始温度下可靠工作2100 s。模块高集成设计在实现系统轻量化的同时,可满足系统结构对刚强度的设计要求。
Aiming at the design requirements of the stringent space size and weight of missile⁃borne platform,a structural design method of missile⁃borne radar is proposed.The front⁃end antenna array adopts an integrated chip ex⁃pandable antenna module,the back⁃end unit modules such as integrated RF unit,integrated processing unit and power supply unit are highly integrated,and the modules are interconnected by hybrid blind mating of RF and LF connectors.The application of integrated chip expandable antenna module makes the antenna array have two⁃dimensional expanding function.At the same time,combined with the RF and LF mixing blind mating technology,the profile height of the anten⁃na array can be effectively reduced.It can meet the high⁃level vibration requirement of 18.5g and work reliably for 2100 s at the initial temperature of 50℃.By introducing the highly integrated design of the modules,the system can meet the design requirements of structural stiffness and strength while achieving light weight.
作者
洪肇斌
汪旭宏
刘琳
周织建
HONG Zhaobin;WANG Xuhong;LIU lin;ZHOU Zhijian(The 38th Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China)
出处
《雷达科学与技术》
北大核心
2023年第2期231-236,共6页
Radar Science and Technology
关键词
低剖面
混频盲配
高集成设计
一体化片式可扩充天线模块
low profile
mixing blind mating
highly integrated design
tile scalable array module(T⁃SAM)
