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直写成型刚玉-莫来石质多孔材料研究

Corundum-mullite porous materials printed by direct ink writing
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摘要 以d_(50)=10.3μm的烧结刚玉微粉、d_(50)=0.2μm的SiO_(2)微粉和化学纯六偏磷酸钠为主要原料,按m(烧结刚玉微粉)∶m(SiO_(2)微粉)=11∶1,每100 g烧结刚玉微粉添加0.15 g六偏磷酸钠的配比配制固含量为63%(φ)的浆料,经真空消泡处理后,采用直写成型技术打印出孔的横截面分别为正三角形、正方形、正六边形的直通孔型多孔材料,研究了孔形、孔径以及受力方向和传热方向对材料常温耐压强度和热导率的影响。结果表明:1)打印出的多孔材料均未出现肉眼可见的缺陷或变形,表面较为光滑平整,挤出线条均匀流畅;打印层间接触紧密,未见分层现象。2)在孔隙率相同时,材料的常温耐压强度按正三角形孔材料、正方形孔材料、正六边形孔材料的顺序逐渐增大,热导率则按此顺序逐渐减小。3)在孔形和孔隙率相同时,材料的常温耐压强度随孔径的增大而减小,热导率则随孔径的增大而增大;在孔形、孔径和孔隙率相同时,平行于直通孔方向的常温耐压强度和热导率大于垂直于直通孔方向上的常温耐压强度和热导率。 Sintered corundum micropowder with 10.3μm of d_(50),SiO_(2)micropowder with 0.2μm of d_(50) and chemically pure sodium hexametaphosphate were used as main raw materials.The slurry with the solid content of 63%(φ)was prepared according to 11∶1 of the mass ratio of sintered corundum micropowder to SiO_(2)micropowder and 0.15∶100 of the mass ratio of sodium hexametaphosphatate to sintered corundum micropowder.After vacuum defoaming treatment,the through-hole porous materials with regular triangle,square and hexagon cross sections were printed by the direct ink writing technology.The effects of the pore shape,pore size,force direction and heat transfer direction on the cold compressive strength and thermal conductivity of the materials were studied.The results show that:(1)the printed porous material has no visible defects or deformation,the surface is relatively smooth and even,and the extrusion lines are uniform and smooth;the contact between the printing layers is close without the stratification phenomenon;(2)at the same porosity,the cold compressive strength of the material increases gradually in the order of regular triangle pore material,square pore material and hexagonal pore material,while the thermal conductivity decreases gradually in this order;(3)at the same pore shape and porosity,the cold compressive strength decreases and the thermal conductivity increases with the increase of the pore size;at the same pore shape,pore size and porosity,the cold compressive strength and the thermal conductivity parallel to the through-hole direction are greater than those perpendicular to the through-hole direction.
作者 朱凯 杨道媛 王美姣 杨亮华 赵祥 陈俊寰 原会雨 Zhu Kai;Yang Daoyuan;Wang Meijiao;Yang Lianghua;Zhao Xiang;Chen Junhuan;Yuan Huiyu(School of Intelligent Manufacturing,Henan Polytechnic,Zhengzhou 450046,Henan,China;不详)
出处 《耐火材料》 CAS 北大核心 2023年第3期200-204,共5页 Refractories
基金 国家自然科学基金青年项目(51902290) 科技部国家重点研发专项(2017YFB0310701) 河南省科技攻关项目(232102230110) 河南省科技创新杰出人才基金(17420051001) 河南职业技术学院科研项目(2022ZK38)。
关键词 3D打印 直写成型 多孔材料 耐压强度 热导率 3D printing direct ink writing porous materials compressive strength thermal conductivity
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