摘要
本文介绍了一种用于5G多输入多输出(MIMO)应用的39 GHz收发器前端芯片组。每个芯片包括两个可变增益的频率转换通道,可以同时支持两个独立波束,芯片还集成了一个本地振荡器链和数字模块,用于多芯片扩展和增益状态控制。为了提高射频性能,对前端系统的关键模块提出了几种电路级改进技术。此外,开发了一种先进的低温共烧陶瓷工艺来封装39 GHz双通道收发器芯片组,实现了低封装损耗和两个发射(TX)/接收(RX)通道之间的高隔离。进行了芯片级和系统级封装(SIP)测量,以演示收发器芯片组的性能。测量结果表明,TX SIP的最大增益为11 dB,饱和输出功率为10 dBm;RX SIP的最大增益为52 dB,噪声系数为5.4 dB,输出压缩点为7.2 dBm。该收发器的单通道通信链路测试表明,64正交调幅(QAM)调制的误差矢量幅度(EVM)为3.72%,频谱效率为3.25 bit·s^(−1)·Hz^(−1);256-QAM调制在1 m距离上的误差矢量幅度(EVM)为3.76%,频谱效率为3.9 bit·s^(−1)·Hz^(−1)。基于该芯片组,还开发了39 GHz多波束原型,用于执行5G毫米波应用的MIMO操作。单流和双流传输的空中通信链路表明,多波束原型机可以覆盖5~150 m的距离,吞吐量相当。
This article presents a 39 GHz transceiver front-end chipset for 5G multi-input multi-output(MIMO)applications.Each chip includes two variable-gain frequency-conversion channels and can support two simultaneous independent beams,and the chips also integrate a local-oscillator chain and digital module for multi-chip extension and gain-state control.To improve the radio-frequency performance,several circuit-level improvement techniques are proposed for the key building blocks in the front-end system.Furthermore,an advanced low-temperature co-fired ceramic process is developed to package the 39 GHz dual-channel transceiver chipset,and it achieves low packaging loss and high isolation between the two transmitting(TX)/receiving(RX)channels.Both the chip-level and system-in-package(SIP)-level measurements are conducted to demonstrate the performance of the transceiver chipset.The measurement characteristics show that the TX SIP provides 11 dB maximum gain and 10 dBm saturated output power,while the RX SIP achieves 52 dB maximum gain,5.4 dB noise figure,and 7.2 dBm output 1 dB compression point.Single-channel communication link testing of the transceiver exhibits an error vector magnitude(EVM)of 3.72%and a spectral efficiency of 3.25 bit·s^(−1)·Hz^(−1)for 64-quadrature amplitude modulation(QAM)modulation and an EVM of 3.76%and spectral efficiency of 3.90 bit·s^(−1)·Hz^(−1)for 256-QAM modulation over a 1 m distance.Based on the chipset,a 39 GHz multi-beam prototype is also developed to perform the MIMO operation for 5G millimetre wave applications.The over-the-air communication link for one-and two-stream transmission indicates that the multi-beam prototype can cover a 5-150 m distance with comparable throughput.
作者
尹宇明
Zhilin Chen
赵晨曦
刘辉华
吴韵秋
Wen-Yan Yin
康凯
Yiming Yu;Zhilin Chen;Chenxi Zhao;Huihua Liu;Yunqiu Wu;Wen-Yan Yin;Kai Kang(School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China;College of Information Science and Electronic Engineering,Zhejiang University,Hangzhou 310058,China)
基金
National Natural Science Foundation of China(62171102 and 61931007)
National Key Research and Development Program of China(2020YFB1805003).
