摘要
研究不同Sb含量Sn-Sb合金在Cu基板上的界面行为,以明确Sb元素对Sn-Sb合金焊料焊接可靠性的影响。通过分析Sn-xSb/Cu体系的显微组织和界面反应热力学,解释界面层的演化过程。结果表明,添加Sb对金属间合物层的生长并非单调递增。Sb能抑制Cu在焊料中的扩散。添加3%Sb(质量分数)使界面反应活化能从286.41降低到62 kJ/mol,促进了界面反应的进行。随着Sb含量增加至10%Sb(质量分数),界面反应活化能提高到686.73 kJ/mol,使界面反应难度增加,减少焊料对Cu基体的熔蚀,并抑制过厚界面层的形成。
In order to determine the effect of Sb element on the welding reliability of Sn−Sb alloy solder,the interfacial behavior of Sn−Sb alloys with different Sb contents on the Cu substrate was investigated.The evolution process of interfacial layers was explained by analyzing the microstructure and interfacial reaction thermodynamics of Sn−xSb/Cu system.The addition of Sb has a non-monotonic effect on the intermetallic compound layers.Sb can inhibit the diffusion of Cu into solder.The addition of 3 wt.%Sb in the alloy reduces the activation energy of interfacial reaction from 286.41 to 62 kJ/mol,which promotes the interfacial reaction.The addition of 10 wt.%Sb increases the activation energy of interfacial reaction to 686.73 kJ/mol,which inhibits the interfacial reaction and reduces the erosion of the Cu substrate by the solder and inhibits the formation of an excessively thick interfacial layer.
作者
王容岳
袁章福
赵宏欣
杨肖
郝煜辉
Rong-yue WANG;Zhang-fu YUAN;Hong-xin ZHAO;Xiao YANG;Yu-hui HAO(Collaborative Innovation Center of Steel Technology,University of Science and Technology Beijing,Beijing 100083,China;Institute of Process Engineering,Chinese Academy of Sciences,Beijing 100190,China;School of Engineering,Westlake University,Hangzhou 310024,China)
基金
supported by the National Natural Science Foundation of China(Nos.U1738101,51974022)
Fundamental Research Funds for the Central Universities,China(No.FRF-MP-20-17)。
