摘要
以双酚A型环氧树脂E124为主体树脂、聚硫醇为固化剂,咪唑为促进剂制备基础胶液。在基础胶液种加入不同比例、不同尺寸的球形氧化铝和不规则氧化铝制备单组分高导热结构胶,探究了不同填充量、不同粒径氧化铝对单组分高导热结构胶热导率、粘接强度、黏度和触变性等性能的影响。结果表明:当基础胶液与3种不同粒径氧化铝质量之比m(基础胶液)∶m(40μm Al_(2)O_(3))∶m(2μm Al_(2)O_(3))∶m(0.5μm Al_(2)O_(3))=15∶59.5∶25.5∶6;m(基础胶液)∶m(40μm Al_(2)O_(3))∶m(5μm Al_(2)O_(3))∶m(0.5μm Al_(2)O_(3))=15∶59.5∶25.5∶8;m(基础胶液)∶m(40μm Al_(2)O_(3))∶m(10μm Al_(2)O_(3))∶m(0.5μm Al_(2)O_(3))=15∶68∶17∶8时,可制得90℃×15 min固化的3种高导热结构胶,其热导率分别为2.73、3.05、2.85 W/(m·K),粘接强度分别为5.49、5.55、5.31 MPa,黏度分别为145000、127467、118467 mPa·s。3种高导热结构胶的体积电阻率均在1014Ω·m以上,经高温高湿和冷、热冲击后粘接残存率分别在70%和90%以上。该高导热结构胶的性能满足了丝网印刷工艺和芯片封装用散热材料的基本性能要求。
A base gel was prepared with bisphenol A epoxy resin E124 as the main resin,polymercaptan as the curing agent,and imidazole as the accelerator.A single component high thermal conductive structural adhesive was prepared by adding different proportions and sizes of spherical alumina and irregular alumina into the base gel.The effects of different filling content and different particle sizes of alumina on the thermal conductivity,bonding strength,viscosity,and thixotropy of the single component high thermal conductive structural adhesive were studied.The results show that when the mass ratio of base gel to the three different particle sizes of alumina is m(base gel)∶m(40μm Al_(2)O_(3))∶m(2μm Al_(2)O_(3))∶m(0.5μm Al_(2)O_(3))=15∶59.5∶25.5∶6,m(base gel)∶m(40μm Al_(2)O_(3))∶m(5μm Al_(2)O_(3))∶m(0.5μm Al_(2)O_(3))=15∶59.5∶25.5∶8,m(base gel)∶m(40μm Al_(2)O_(3))∶m(10μm Al_(2)O_(3))∶m(0.5μm Al_(2)O_(3))=15∶68∶17∶8,three kinds of high thermal conductive structural adhesives cured at 90℃for 15 min can be obtained,their thermal conductivity is 2.73,3.05,2.85 W/(m·K),their bonding strength is 5.49,5.55 and 5.31 MPa,and their viscosity is 145000,127467 and 118467 mPa·s,respectively.The volume resistivity of the three kinds of high thermal conductive structural adhesives is above 1014Ω·m,and the adhesive survival rate after high temperature and humidity,cold and thermal shock is more than 70%and 90%,respectively.The performance of the high thermal conductive structural adhesive meets the basic performance requirements of screen printing and heat dissipation materials for chip packaging.
作者
陈嘉亮
王刚
夏婷
苏建峰
李会录
CHEN Jialiang;WANG Gang;XIA Ting;SU Jianfeng;LI Huilu(College of Material Science and Engineering,Xi′an University of Science and Technology,Xi′an 710054,China)
出处
《绝缘材料》
CAS
北大核心
2023年第7期25-31,共7页
Insulating Materials
基金
国家自然科学基金资助项目(51903207)。
关键词
环氧树脂
黏度
热导率
粘结强度
氧化铝
填料
epoxy resin
viscosity
thermal conductivity
bonding strength
alumina
filler
